3D Printed RF Resonator Geometry and Assembly
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Solution Overview
Problem
Current methods for manufacturing radiofrequency resonant elements, such as coils, are limited in producing various shapes and sections, and struggle with deformation due to their small size and mechanical vibrations, while also complicating the integration of holding elements.
Innovation Solution
A method involving three-dimensional printing, including laser fusion on a powder bed or molten wire deposition, allows for the creation of resonant elements with customizable geometries and the integration of fixing tabs directly onto the printed circuit, enabling secure assembly and diverse shapes without the need for specific tooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional winding methods are used to manufacture resonant elements, then cylindrical coils can be produced, but the variety of geometries is limited and conductor deformation risk increases
Solution Approach 1:
The patent replaces the traditional mechanical winding process with a three-dimensional printing process. This substitution allows for the creation of resonant elements with diverse geometries (elliptical, rectangular, irregular shapes) without the constraints of winding methods, eliminating conductor deformation risks and enabling complex cross-sections that were previously difficult or impossible to manufacture.
Solution Approach 2:
The invention changes the manufacturing parameters from mechanical winding constraints to additive manufacturing parameters. The three-dimensional printing process allows independent control of geometric parameters (cross-sectional shape, coil diameter, turn spacing, overall dimensions) without the interdependencies that exist in traditional winding, enabling precise customization of resonant element geometry while simplifying the manufacturing process.
2Volume of moving object
If resonant elements are made very small to minimize device size, then device footprint is reduced, but deformation under weight and vibrations increases
Solution Approach 1:
The patent employs composite material structures in the three-dimensional printed resonant elements, combining conductive materials with supportive structural materials. This allows the creation of miniaturized resonant elements that maintain structural integrity through optimized internal geometries and material distributions, preventing deformation under weight and vibrations while keeping the device footprint small.
Solution Approach 2:
The invention transitions from two-dimensional planar resonant elements to three-dimensional structures with optimized spatial arrangements. The additive manufacturing process enables complex 3D geometries that provide enhanced structural rigidity and deformation resistance in miniaturized resonant elements, allowing them to maintain stability at smaller sizes through vertical and spatial optimization rather than just increasing planar dimensions.
3Ease of operation
If retaining elements are integrated during manufacturing, then assembly is simplified, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the manufacturing of the resonant element body and its retaining elements (mounting tabs, fixing features) into a single three-dimensional printing operation. This consolidation eliminates separate manufacturing and assembly steps for retaining elements, simplifying the overall assembly process while the additive manufacturing technology handles the increased geometric complexity without requiring additional manufacturing equipment or processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the easy production of resonant elements with a wide range of shapes and sections, reduces deformation, and integrates holding elements seamlessly, facilitating the miniaturization of radiofrequency devices while maintaining electrical performance.
Implementation Method 1
The three-dimensional printing step includes a powder bed fusion laser step
Implementation Method 2
The three-dimensional printing step includes a fused filament deposition step
Data Source
Figure 1
Figure 2~3
AI summary
A method for manufacturing an electronic device (8) comprising at least one radio frequency resonant element (12) connected to a printed circuit board (10), the method comprising: - a step of manufacturing the resonant element (12); and - a step of attaching the resonant element (12) to the printed circuit board (10) in an assembled position. The manufacturing step of the resonant element (12) includes a step of three-dimensional printing of at least one blank of the resonant element (12).