3D-Printed Semiconductor Substrates With Curved Interconnects
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Solution Overview
Problem
The existing semiconductor packaging technologies face challenges in reducing the high costs associated with interconnection processes and in providing customized packaging structures for diverse customer demands, especially as semiconductor applications expand into AI, vehicles, and smart factories.
Innovation Solution
The use of 3D printing technology for customized semiconductor packaging allows for the simplification of interconnection processes and the reduction of costs by forming interconnection structures directly, optimizing process costs by eliminating separate interconnection processes, and creating substrates with tailored shapes and patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnection processes are used for semiconductor packaging, then electrical connection between semiconductor parts is achieved, but costs of interconnection processes occupy most of the costs of semiconductor packaging
Solution Approach 1:
The patent merges the substrate formation process and interconnection structure formation process into a single 3D printing operation. The support structure is printed integrally with the substrate, eliminating separate interconnection processes and reducing manufacturing costs while maintaining electrical connection functionality.
Solution Approach 2:
The patent changes the manufacturing parameter from conventional multi-step fabrication to 3D printing technology. This enables direct formation of complex interconnection structures with curved lines and varying cross-sections, simplifying the process and reducing costs associated with traditional interconnection manufacturing.
2Adaptability or versatility
If conventional semiconductor production facilities are used, then standardized packaging is produced, but it is difficult to provide customized packaging structures for diversified customer demands
Solution Approach 1:
The patent introduces dynamic flexibility to the packaging process through 3D printing technology. The support structure can be dynamically adjusted in terms of shape, size, and configuration to match specific customer requirements, enabling customization without requiring complex facility reconfiguration.
Solution Approach 2:
The patent applies local quality by allowing different regions of the support structure to have different properties. The 3D printing process enables variation in line curvature, thickness, and material composition at different locations, facilitating customized packaging solutions for specific application requirements.
3Reliability
If complex interconnection structures are formed using conventional methods, then electrical connection requirements are met, but costs are increased sharply
Solution Approach 1:
The patent replaces complex mechanical interconnection fabrication processes with 3D printing technology. This substitution enables direct deposition of conductive materials in complex geometries without requiring multiple mechanical steps, thereby reducing manufacturing costs while meeting electrical connection requirements.
Solution Approach 2:
The patent transitions from planar interconnection structures to three-dimensional configurations. The support structure incorporates curved lines and varying cross-sections that leverage the third dimension, enabling complex electrical connections to be formed more efficiently and at lower cost through additive manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of complex interconnection structures with reduced costs, improved process efficiency, and the ability to produce customized packaging solutions that meet the diverse needs of semiconductor customers.
Implementation Method 1
a photopolymerisation type 3D printing apparatus for producing the packaging structure
Implementation Method 2
a laser beam melting type 3D printing apparatus for producing the packaging structure
Data Source
AI summary
According to various embodiments, a substrate for electrical connection between electronic components may include: a body having a single layer structure; and at least one interconnect having a conductivity formed inside the body, wherein the at least one interconnect includes one side and the other side exposed to the outside of the body, and a line connecting the one side and the other side, and wherein the line is crossed in a transverse direction or a longitudinal direction through the inside of the body of the single layer structure, and may be implemented to have a specific curvature in some sections. Other various embodiments are possible.