3D-Printed Shielding Structure for Reliable Semiconductor Packaging
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Solution Overview
Problem
Existing cage-shaped electromagnetic shielding structures in semiconductor packaging suffer from deformation and structural delamination due to large wire diameters and thermal expansion mismatches, leading to reduced shielding effectiveness and increased spurious signal transmission.
Innovation Solution
A manufacturing method utilizing 3D printing technology to form a shielding portion on a substrate, followed by encapsulation and metal layer formation, enhancing bonding strength and reliability through crosslinking reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to form cage-shaped shielding structure, then electromagnetic shielding is provided, but the large diameter of vertical metal wires causes deformation or breakage under molding flow, reducing shielding effectiveness
Solution Approach 1:
The patent replaces the mechanical wire bonding process with a printing process to form conductive patterns. Instead of bonding metal wires mechanically, the invention uses printing material to directly form conductive traces and shielding structures on the substrate, eliminating the deformation and breakage issues associated with mechanical wire bonding under molding flow
Solution Approach 2:
The patent changes the physical state and properties of the conductive material by using printing material that can be deposited in a controlled manner. The printing material forms conductive patterns with precise dimensions and spacing, transforming the approach from assembling discrete wire components to depositing a continuous conductive layer with controlled parameters
2Reliability
If vertical metal wires are used for shielding, then electromagnetic shielding is achieved, but the large difference in coefficient of thermal expansion causes structural delamination
Solution Approach 1:
The patent uses composite material structure where the printing material serves as both the conductive element and the bonding interface. The printing material is formulated to have thermal expansion properties compatible with both the substrate and the encapsulation, creating a composite structure that maintains integrity under thermal stress
Solution Approach 2:
The printing material acts as an intermediary between the substrate and the encapsulation, replacing the metal wires that caused thermal expansion mismatch. This intermediary material has thermal properties that bridge the gap between the substrate and encapsulation, preventing delamination
3Manufacturing precision
If 3D printing technology is used to form shielding portion, then deformation risk is reduced, but additional printing process steps are required
Solution Approach 1:
The patent merges the shielding structure formation with the existing conductive pattern printing process. The same printing apparatus and material deposition techniques used for creating circuit traces are also used to form the shielding structures, consolidating multiple functions into a single integrated process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method improves wire bonding efficiency, reduces deformation risk, and enhances electromagnetic shielding reliability by securing the shielding portion and increasing bonding strength between the shielding portion and encapsulation.
Implementation Method 1
the molding compound undergoes a crosslinking reaction with the printing material
Data Source
AI summary
Provided are manufacturing method of electromagnetic shielding structure and packaging structure. Manufacturing method includes providing substrate having first element; and forming shielding portion on substrate by using 3D printing technology, wherein shielding portion is arranged at periphery of first element; and the step includes: constructing three-dimensional model of shielding portion; identifying target position on substrate; and laying printing material at target position based on three-dimensional model to pre-form shielding portion; injecting molding compound onto substrate to form encapsulation that encapsulates first element and shielding portion, wherein molding compound undergoes crosslinking reaction with printing material; grinding encapsulation so that shielding portion is exposed from surface of encapsulation; and forming metal layer on surface of encapsulation, wherein metal layer is electrically connected to shielding portion, and at least one of metal layer and shielding portion has grounding properties.