3D Printed SIM Card Body with Integrated Chip Module
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Solution Overview
Problem
The existing methods for producing SIM cards are costly and time-consuming due to separate processes for producing card bodies and chip modules, followed by expensive and time-consuming electrical and optical personalization.
Innovation Solution
A method involving three-dimensional printing of the data carrier body using a 3D printer, where the chip module's contact surface elements are electrically connected to the chip terminals via flip-chip or wire-bond technology, and the data carrier is personalized during production, allowing for in-line production and flexible sizing and shaping, including optical personalization using digital or screen printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate processes are used for producing card bodies and chip modules, then manufacturing precision can be maintained, but production time and costs increase significantly
Solution Approach 1:
The patent combines the card body and chip module into a single integrated component produced via 3D printing. The card body includes an integrated chip module recess and contact element arrangement, eliminating the need for separate production and assembly processes. This merging reduces production time while maintaining precision through additive manufacturing capabilities.
Solution Approach 2:
The 3D printing process produces the card body with pre-integrated chip module mounting structures and contact elements. The chip module recess and contact element arrangements are formed during the initial printing process, preparing the card body for direct chip module installation without requiring subsequent complex assembly operations.
2Ease of manufacture
If separate processes are used for producing card bodies and chip modules, then ease of manufacture is improved, but production costs increase
Solution Approach 1:
The patent merges the card body and chip module production into a single 3D printing process. The card body is printed with integrated chip module recesses and contact elements, eliminating the need for separate manufacturing of card bodies and chip modules plus their assembly. This integration significantly reduces production costs while maintaining ease of manufacture through additive manufacturing.
Solution Approach 2:
The 3D printing process serves multiple functions: it produces the card body structure, creates the chip module recess, forms the contact element arrangements, and enables direct integration of the chip module. This multi-functionality consolidates multiple manufacturing steps into one process, reducing overall production costs.
3Manufacturing precision
If personalization is performed after chip module installation, then manufacturing precision is maintained, but production time increases
Solution Approach 1:
The patent performs personalization markings and text printing on the card body during the 3D printing process itself, before chip module installation. The 3D printer can directly deposit materials or apply markings as part of the building process, enabling early personalization without affecting subsequent assembly steps or final product precision.
4Ease of manufacture
If standardized card bodies are used, then ease of manufacture is improved, but adaptability decreases
Solution Approach 1:
The 3D printing process enables dynamic customization of card bodies. Unlike standardized mass-produced card bodies, the additive manufacturing process can adjust design parameters, dimensions, contact element arrangements, and personalization markings for each individual card or small batches, providing full adaptability while maintaining manufacturing efficiency.
Solution Approach 2:
The patent enables local customization of card body features through 3D printing. Different regions of the card body can have different properties, dimensions, or markings tailored to specific requirements. The chip module recess and contact element arrangements can be locally optimized for different chip types or application needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces production costs and time by integrating personalization and module insertion into a single, efficient process, enabling quick and cost-effective production of customizable SIM cards and other portable data carriers.
Implementation Method 1
the data carrier body is printed using a three-dimensional printer
Implementation Method 2
a three-dimensional identification is printed on at least one surface of the data carrier body
Data Source
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Figure 2
AI summary
The present invention discloses a method for manufacturing a portable data carrier with a chip 6, characterized by the steps of providing a module carrier tape 2 which carries at least one module 4, wherein the module 4 has at least one contact surface element 8 and at least one chip 6, furthermore, each contact 10 of the contact surface element 8 is electrically connected to each terminal of the chip 6, and a data carrier body 14 is printed onto the module carrier tape 2, such that the chip 6 is surrounded by the data carrier body 14 and the contact surface element 8 is located on the surface of the data carrier body 14.