3D-Printed Stack Components With Interposer-Pin Layer Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing stack components are labor-intensive, costly, and lack design freedom, making it difficult to achieve high density and variety in stacking structures.
Innovation Solution
Simultaneously print and form circuit layers and interposers side by side using a 3D printer, then mount the interposer on the circuit layer, and connect the layers with interlayer connection pins inserted into the interposer to facilitate efficient assembly and diversify the stacking structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional methods using multiple printed circuit boards are used to manufacture stack components, then electrical connection between layers is achieved, but productivity is poor and manufacturing cost is high due to many labor-intensive steps
Solution Approach 1:
The patent combines the circuit layer and interposer into a single integrated structure that is printed simultaneously in one manufacturing process. This merging eliminates the need for separate manufacturing and assembly steps for these components, directly resolving the contradiction by reducing device complexity while improving productivity.
Solution Approach 2:
The interposer is pre-formed as part of the circuit layer structure during the printing process, before any assembly operations. This preliminary integration of the interposer function into the circuit layer manufacturing process eliminates subsequent assembly steps, addressing both productivity and complexity concerns.
2Adaptability or versatility
If conventional methods with separate circuit layers and interposers are used, then manufacturing is possible, but design freedom is limited and variety in stacking structure cannot be sufficiently met
Solution Approach 1:
By merging the circuit layer and interposer into a single printable structure, the patent enables flexible design variations in stacking configurations without increasing manufacturing complexity. The integrated design allows different stacking patterns and interposer configurations to be achieved through single-printing operations, enhancing adaptability.
Solution Approach 2:
The patent utilizes parameter changes in the printing process (such as layer thickness, material composition, and structural geometry) to create varied stacking structures. By adjusting these parameters during the single printing operation, diverse designs can be achieved without complicating the manufacturing process.
3Manufacturing precision
If multiple labor-intensive steps are used to assemble stack components, then precise assembly is possible, but manufacturing cost is high
Solution Approach 1:
The integration of circuit layer and interposer into a single printed structure eliminates multiple assembly operations, reducing manufacturing cost while maintaining precision through the controlled printing process. The single-step manufacturing approach inherently ensures precision without requiring costly multi-step assembly operations.
Solution Approach 2:
The patent replaces mechanical assembly operations with a direct printing process that forms both the circuit layer and interposer structures. This substitution eliminates labor-intensive mechanical steps while maintaining manufacturing precision through digital control of the printing process, thereby reducing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances productivity, reduces manufacturing costs, and allows for diverse and high-density stacking configurations by enabling simultaneous formation of circuit layers and interposers, as well as easy diversification of the stacking structure.
Implementation Method 1
a circuit layer and an interposer are simultaneously printed and formed side by side in a planar manner by a 3D printer
Data Source
Figure 1A~1D
Figure 2~3
Figure 4
AI summary
In a method for manufacturing a stack component in which an interposer (12) is interposed to form a space for inserting an interlayer connection pin (13) between circuit layers (11) to be stacked, the method includes a printing step of simultaneously printing and forming the circuit layer and the interposer side by side in a planar manner by a 3D printer, a step of mounting a circuit element (14) on the circuit layer, a step of mounting the interposer on the circuit layer, a step of inserting the interlayer connection pin into the interposer mounted on the circuit layer, and a step of electrically connecting the circuit layer and another circuit layer by the interlayer connection pin by stacking the other circuit layer on the circuit layer via the interposer.