3D Printed Conductive Wire Package Structure
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Solution Overview
Problem
Traditional semiconductor package bonding methods, such as wire bonding, face limitations in miniaturization due to constraints on arc height and distance, which restrict the reduction of package size and the number of input/output leads.
Innovation Solution
A package structure utilizing a lead frame with a recess, an adhesive layer, and 3D printing conductive wires, where the die is placed in the recess and the lead frame is electrically connected to the pad using 3D printing conductive wires, allowing for reduced thickness and increased I/O leads without the limitations of traditional wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding is used for internal bonding, then the bonding process is mature and cost-effective, but the package size cannot be miniaturized due to limitations on arc height and distance
Solution Approach 1:
The patent changes the bonding method from traditional wire bonding to 3D printing conductive wire bonding. This parameter change allows for direct writing of conductive wires on the pad structure without arc height limitations, enabling package miniaturization while maintaining manufacturing feasibility through additive manufacturing technology.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a 3D printing system. Instead of using mechanical wire bonding equipment that requires arc height and distance, the invention uses 3D printing technology to directly deposit conductive material, substituting the mechanical bonding process with an additive manufacturing process that enables smaller package dimensions.
2Ease of manufacture
If wire bonding is used for internal bonding, then the bonding process is mature, but the number of I/O leads is limited
Solution Approach 1:
The patent changes the bonding methodology to 3D printing, which enables increased I/O leads by allowing direct writing of multiple conductive wires on the pad structure without the arc height and distance constraints of traditional wire bonding. This parameter change in the bonding process directly increases the quantity of I/O leads that can be implemented.
3Ease of manufacture
If traditional wire bonding process is used, then the bonding can be achieved, but the package thickness cannot be reduced
Solution Approach 1:
The patent replaces the traditional wire bonding mechanical system with 3D printing technology. This substitution eliminates the need for arc height and distance requirements, allowing conductive wires to be directly deposited on the pad structure and enabling significant reduction in package thickness while maintaining achievable bonding.
4Reliability
If RDL process and wire bonding process are used, then the electrical connection can be established, but the manufacturing process becomes complex
Solution Approach 1:
The patent merges the RDL process and wire bonding process into a single 3D printing conductive wire process. By combining these previously separate manufacturing steps into one additive manufacturing operation, the invention simplifies the overall manufacturing process while maintaining reliable electrical connection between the lead frame and pad.
Solution Approach 2:
The patent extracts and eliminates the RDL process from the manufacturing sequence by directly printing conductive wires on the pad structure. This extraction of the RDL step, combined with replacing wire bonding with 3D printing, simplifies the manufacturing process while preserving the essential electrical connection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables miniaturization of the package size and simplifies the manufacturing process by eliminating the need for redistribution layers and wire bonding, while allowing for increased I/O leads and reduced thickness.
Implementation Method 1
The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier
Implementation Method 2
forming at least one 3D printing conductive wire on the lead frame, the adhesive layer, and the pad by using a 3D printing process
Data Source
AI summary
A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.