3D Printing Electronic Component Integration Method
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Solution Overview
Problem
3D printing technologies face limitations in integrating electronic components due to size, shape, and structural constraints, leading to reduced throughput and performance capabilities, as fully assembled components cannot be easily embedded within printed parts, requiring manual or automated assembly processes that can compromise component effectiveness.
Innovation Solution
A method for generating a 3D printing file that integrates both part and electronic component specifications, allowing for simultaneous layer-by-layer printing of parts with embedded electronic components, eliminating the need for post-production assembly and enhancing performance capabilities by determining optimal electronic component configurations and material properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual or automated assembly processes are used to embed electronic components in printed parts, then component integration is achieved, but manufacturing time increases and productivity decreases
Solution Approach 1:
The patent merges the 3D printing process with electronic component assembly by simultaneously printing the part structure and embedding electronic components within the same manufacturing cycle. The 3D printing system integrates multiple functions: printing the part body, positioning electronic components, and embedding them within the printed structure, thereby eliminating separate assembly operations and improving productivity.
Solution Approach 2:
The patent applies preliminary action by pre-positioning electronic components within the 3D printing build volume before the printing process completes. The system determines optimal positions for electronic components during the design phase and maintains these positions throughout the printing process, ensuring components are embedded correctly without requiring post-printing assembly operations.
2Reliability
If electronic components are designed to withstand manual or machine automated embedding processes, then component durability is improved, but design flexibility and performance capability are reduced
Solution Approach 1:
The system performs preliminary determination of optimal electronic component positions and configurations during the design phase, before the printing process begins. This allows the part geometry to be specifically tailored to accommodate electronic components in their optimal positions, ensuring both durability during printing and optimal performance, without requiring components to be designed for generic embedding processes.
Solution Approach 2:
The patent applies local quality by creating part geometries with specific local characteristics at positions where electronic components will be embedded. The 3D printing process deposits material with different properties or structural characteristics at specific locations to optimize both the durability of the embedding process and the performance of the electronic components, rather than using uniform design throughout.
3Ease of manufacture
If fully assembled electronic components are attempted to be embedded within printed parts, then integration is achieved, but size and shape constraints are exceeded
Solution Approach 1:
The patent segments the electronic component assembly process into individual component embedding operations performed during the 3D printing process. Instead of attempting to embed fully assembled components, the system embeds individual electronic components as they are printed, allowing for more efficient use of space and avoiding the size constraints that would result from embedding complete assemblies.
Solution Approach 2:
The patent utilizes the third dimension (depth/build height) of the 3D printing process to accommodate electronic components. By embedding components at different vertical levels and positions within the build volume, the system achieves high integration without increasing the overall footprint or volume of the part, effectively using spatial dimensions to optimize integration.
Data Source
AI summary
A method is disclosed for generating a 3D printing file containing an object model of a part having a body and an integral electronic component. To generate the 3D printing file, a processor receives at least one geometry specification of the part to be printed and at least one component performance property of the electronic component to be printed integral to the part. An object model is determined by the processor in accordance with the at least one geometry specification of a part to be printed, the at least one component performance property of an electronic component to be printed, and at least one material property of an electronic component printing material of a 3D printer. The 3D printing file is generated by the processor and comprises the object model.