3D Printing Heat Dissipation for Structural Rigidity

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Solution Overview

Problem

Current three-dimensional printing technologies using bottom-up SLA face issues with the structural rigidity and strength of printed objects due to the soft nature of photocurable materials, leading to deformation and cracking, which affects the fineness and success rate of the finished products.

Innovation Solution

A three-dimensional printing apparatus equipped with a heat dissipation assembly that either directly or indirectly cools the printed object, improving its structural rigidity and strength by reducing temperature, thereby enhancing the printing process's success rate and product fineness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If photocurable material is used for three-dimensional printing, then fine finished-products can be made, but the printed object lacks structural rigidity and strength causing deformation or cracking

Engineering Contradiction:
Improvefineness of finished-productVSAvoidstructural rigidity and strength of printed object
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent applies parameter changes by controlling the temperature of the printed object during the printing process. Specifically, the system maintains the printed object at a lower temperature (e.g., 25°C or below) to increase its structural rigidity and strength, preventing deformation and cracking while still achieving fine finished-products through the photocurable material curing process.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If photocurable material is cured layer by layer, then three-dimensional printed objects can be formed, but the soft material causes deformation under stress during printing

Engineering Contradiction:
Improveprinting process capabilityVSAvoidstructural stability of printed object
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent uses parameter changes by controlling temperature to stabilize the printed object's structure. The heat dissipation assembly maintains the object at a lower temperature throughout the layer-by-layer curing process, providing structural stability and preventing deformation under stress while enabling the printing process to proceed.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent applies preliminary action by pre-cooling the printed object before and during the curing process. The heat dissipation assembly is activated before printing begins and continues to cool the object during printing, preparing the material in advance to withstand stresses during the manufacturing process.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of a heat dissipation assembly in the printing apparatus temporarily increases the structural rigidity and strength of printed objects, enabling them to withstand printing stresses and improving the overall success rate and fineness of the products.

Implementation Method 1

a heat dissipation assembly is adjacent to an tank, and may directly or indirectly decrease a temperature of a printed object

Methodology Applied
Scientific EffectHeat dissipation: Cooling

Data Source

PatentUS11679559B2Three-dimensional printing apparatus and manufacturing method thereof
Publication Date: 2023.06.20 YOUNG OPTICS
  • US11679559B2 patent drawing
  • US11679559B2 patent drawing
  • US11679559B2 patent drawing

AI summary

A three-dimensional printing apparatus includes a tank, a transparent plate, a printing platform, a projector and a heat dissipation assembly. The tank accommodates a photocurable material, and the transparent plate is disposed adjacent to the tank. The printing platform and the projector are respectively disposed on opposite sides of the transparent plate. The heat dissipation assembly is disposed adjacent to the tank.