3D Printing Resin Composition for Stiff Water-Removable Molds
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Solution Overview
Problem
Existing 3D printing compositions for molding applications often fail to provide high stiffness and mechanical properties required for forming thin molds or molds with fine features, limiting their end use in injection molding and other processes.
Innovation Solution
Compositions comprising specific compounds with structures of Formula (I) and/or Formula (II), along with monomeric curable materials and acrylate or acrylamide components, are used to create 3D articles with improved mechanical properties, allowing for the formation of molds that can be easily removed post-solidification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional build materials are used for 3D printing molds, then the printing process can be completed, but the resulting molds lack sufficient stiffness and mechanical properties for thin molds or fine features
Solution Approach 1:
The patent uses a composite build material system comprising a polyol component and an isocyanate component. This composite material system provides enhanced mechanical properties and stiffness compared to conventional single-material systems, enabling the formation of thin molds and fine features with sufficient structural integrity for injection molding applications.
Solution Approach 2:
The patent modifies the chemical composition parameters of the build material by specifying particular polyols (such as polyethylene glycol, polypropylene glycol, or polyester polyols) and isocyanates (such as toluene diisocyanate or methylene diphenyl diisocyanate). These parameter changes result in materials with optimized mechanical properties and stiffness for molding applications.
2Ease of operation
If conventional build materials are used, then articles can be formed, but the materials cannot be dissolved or dispersed in water for easy mold removal
Solution Approach 1:
The patent incorporates water-soluble or water-dispersible components into the build material formulation. The polyol and isocyanate components are selected or modified to create a polymer structure that maintains mechanical integrity during use but can be dissolved or dispersed in water for easy mold removal after the molding process is complete.
3Manufacturing precision
If the build material provides high stiffness for thin molds, then molding precision is improved, but the material complexity increases
Solution Approach 1:
The patent achieves high stiffness and precision through controlled changes in the chemical parameters of the polyol and isocyanate components rather than through complex multi-material systems or sophisticated processing mechanisms. The material composition is optimized to provide the necessary mechanical properties for thin molds and fine features while maintaining relatively simple material formulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described compositions enable the production of 3D articles with a Young's Modulus greater than 100,000 kPa and facilitate the creation of molds that can be dissolved or dispersed in water, enhancing the suitability for molding applications.
Implementation Method 1
a monomeric curable material having the structure of Formula (III)... In some instances, the composition is liquid at ambient temperatures. Build materials can be selectively cured, solidified, or otherwise altered during a build.
Data Source
Figure 1A~1E
AI summary
In one aspect, compositions or build materials for use with an additive manufacturing system are described herein. In some embodiments, a composition described herein comprises a compound having the structure of Formula (I) and/or a compound having the structure of Formula (II), wherein the compound having the structure of Formula (I) and/or Formula (II) is present in an amount of 10-35 wt. %, based on the total weight of the composition; and a monomeric curable material having the structure of Formula (III). In some implementations, the monomeric curable material of Formula (III) is present in an amount of 30-50 wt. %, based on the total weight of the composition. In some cases, the composition further comprises an acrylate or acrylamide component. In some instances, the acrylate or acrylamide component is present in an amount of 25-50 wt. %, based on the total weight of the composition.