3D Printing Thermal Simulation for Layer Heat Transfer Control

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Solution Overview

Problem

The quality of 3D printed objects is heavily influenced by thermal control, which is complex due to various factors including the processing of sinterable materials and operating conditions of 3D printing devices, making it challenging to predict and optimize the thermal profile effectively.

Innovation Solution

A 3D object printing simulator system that includes a layer module and a printing device controller to simulate the printing process, adjusting based on physical characteristics, and a cyber-physical simulator that models heat transfer from layers, allowing for the prediction of thermal situations and optimization of the printing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If thermal control is implemented to improve 3D printing quality, then manufacturing precision is improved, but device complexity increases due to multiple thermal factors and processing conditions

Engineering Contradiction:
Improve3D printing qualityVSAvoidthermal control system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by implementing a simulation system that predicts thermal profiles and processing outcomes before actual 3D printing occurs. The simulation module calculates thermal situations in advance, allowing optimization of thermal control parameters without requiring complex real-time control systems during printing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent uses copying by creating a virtual model of the thermal printing process through simulation. Instead of directly controlling physical thermal parameters during printing, the system creates a digital replica of the thermal field and material response, allowing prediction and optimization without direct intervention in the physical printing process.

Inventive Principle:
Principle #26Copying

2Productivity

If simulation is used to predict thermal situations, then productivity is improved by reducing experimental time, but device complexity increases due to additional simulation hardware and software

Engineering Contradiction:
Improveprocess optimization speedVSAvoidsimulation system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The simulation system creates a virtual copy of the thermal printing process, allowing multiple scenarios to be tested digitally before physical implementation. This copying approach enables rapid prediction of thermal outcomes without requiring additional physical experimental equipment or prolonged trial-and-error testing.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent replaces physical experimental trial-and-error with computational simulation. Instead of physically testing different thermal parameters through repeated experiments, the system uses software-based thermal field simulation to predict outcomes, substituting mechanical experimentation with digital computation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If material properties are adjusted to improve thermal control, then manufacturing precision is improved, but loss of substance increases due to iterative experimentation

Engineering Contradiction:
Improvethermal profile controlVSAvoidsinterable material waste
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

The simulation system performs preliminary analysis of material thermal response before actual printing begins. By predicting how sinterable materials will behave under different thermal conditions through simulation, the system identifies optimal material parameters and printing settings in advance, preventing material waste from failed experimental prints.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system creates a digital model of material thermal properties and behavior, allowing virtual testing of different material formulations and thermal parameters. This copying of material behavior into simulation enables optimization of material usage without requiring physical experimentation that would consume actual sinterable material.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the prediction of thermal situations and optimization of the 3D printing process, improving the design and quality of 3D objects by allowing for adjustments in hardware components and firmware control schemes before actual production, reducing material usage and experimental time.

Implementation Method 1

a layer module to simulate heat transfer from layers of the simulated 3D object

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

allowing for the prediction of thermal situations and optimization of the printing process

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3408071B1Three-dimensional (3D) object printing simulator
Publication Date: 2023.03.01 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • EP3408071B1 patent drawingFigure 1
  • EP3408071B1 patent drawingFigure 2
  • EP3408071B1 patent drawingFigure 3

AI summary

A three-dimensional (3D) object printing process-level simulator including, in an example, a layer module for modeling a plurality of layers of a simulated 3D object to be built and a printing device controller to receive a number of simulated values from the layer module to simulate a 3D object printing process and adjust the 3D object printing process based on physical characteristics of a printing device associated with the printing device controller. A cyber-physical three-dimensional (3D) object printing simulator including, in an example, a printing device including a processor to send instructions describing how a simulated 3D object is to be printed and a layers module to simulate heat transfer from a plurality of layers in the 3D object to be printed based at least a density of the plurality of layers.