3D Electromagnetic Probe Positioning for Cryptographic Chip Fault Injection
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Solution Overview
Problem
Current electromagnetic fault injection methods for cryptographic chips suffer from insufficient spatial accuracy, leading to ineffective tests and prolonged cycles due to the inability to accurately control the position of fault injection, which limits the effectiveness of fault injection tests.
Innovation Solution
A high-spatial-accuracy electromagnetic fault injection method that adjusts the position and angle of the electromagnetic probe in three dimensions (X, Y, Z) and angle relative to the chip, optimizing the coupling efficiency between the electromagnetic field and the chip circuit, enabling precise fault injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If electromagnetic fault injection is performed using conventional methods, then fault injection can be performed without touching the chip, but spatial accuracy is insufficient and injection effectiveness is limited
Solution Approach 1:
The patent transitions from conventional two-dimensional plane positioning to three-dimensional spatial positioning by introducing the Z-axis dimension (vertical distance from chip surface) and angular orientation parameters. This dimensional expansion enables precise localization of sensitive positions in space, directly resolving the spatial accuracy limitation while maintaining non-contact injection capability.
Solution Approach 2:
The patent introduces multiple new parameters beyond simple XY coordinates, including Z-axis distance, horizontal angle, and vertical angle parameters. By changing and optimizing these parameters systematically, the method achieves high spatial accuracy and improves injection effectiveness, solving the contradiction between measurement precision and reliability.
2Measurement precision
If spatial positioning is performed only on the plane without considering physical structure, then positioning is simplified, but high-spatial-accuracy electromagnetic fault injection cannot be implemented
Solution Approach 1:
The patent performs preliminary characterization of the chip's physical structure and identifies sensitive positions before conducting fault injection tests. By pre-mapping the three-dimensional sensitive position distribution and storing this information, the system eliminates the need for complex real-time analysis during testing, thus achieving high spatial accuracy without excessive complexity during operation.
Solution Approach 2:
The patent creates a three-dimensional sensitive position map that copies and represents the physical structure's electromagnetic characteristics. This digital model allows the system to reference pre-determined sensitive positions and parameters, avoiding the need for complex real-time physical analysis and reducing operational complexity while maintaining high precision.
3Reliability
If the probe position is not adjusted, then the testing process is simpler, but the electromagnetic fault injection test may fail due to insufficient spatial accuracy
Solution Approach 1:
The patent implements a feedback mechanism where the system monitors whether fault injection successfully inverts target bits in the ciphertext. Based on this feedback, the system automatically adjusts the probe's three-dimensional position and angular parameters, and re-attempts injection if needed. This closed-loop approach ensures high test success rate while systematically reducing the number of failed attempts through intelligent parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves the accuracy and efficiency of fault injection, reducing the number of tests required and enhancing the effectiveness of differential fault analysis, thereby improving the security of cryptographic chips.
Implementation Method 1
transmitting an electromagnetic pulse to the cryptographic chip to be tested
Data Source
AI summary
Disclosed in the present application is a high-spatial-accuracy electromagnetic fault injection method for a cryptographic chip. According to the method, a spatial position of an electromagnetic probe is adjusted according to a physical structure of a target chip and the characteristic of an integrated circuit, including accurate positioning of three dimensions of X, Y and Z as well as an angle with a surface of the chip, so that electromagnetic fault injection acts on a key area of the chip more accurately, thereby improving the pertinence and efficiency of fault injection.