3D Sensing Projector Assembly with Integrated Holder and EMI Grounding
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Solution Overview
Problem
The fabrication process of 3D sensing modules, such as those using Time of Flight (TOF) technology, is complex and costly due to the intricate assembly requirements.
Innovation Solution
A projector and 3D sensing module design that incorporates a circuit board with bonding pads, a holder with a cavity and bonding pads, and a lens module, secured using surface mounted technology (SMT) with an electromagnetic interference (EMI) shielding plate for grounding, simplifying the assembly and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional fabrication processes are used for 3D sensing modules, then manufacturing precision and reliability are maintained, but device complexity and fabrication cost increase significantly
Solution Approach 1:
The patent merges the holder structure with mounting functionality by integrating bonding pads directly onto the holder substrate. This combines structural support and electrical connection functions into a single component, eliminating separate mounting brackets and reducing assembly steps. The holder simultaneously provides mechanical support, electrical grounding, and component mounting capabilities.
Solution Approach 2:
The holder is designed as a multi-functional component that serves multiple purposes: structural support for the circuit board, electrical grounding through integrated bonding pads, mounting structure for electronic components, and EMI shielding when combined with the shielding plate. This universal design reduces the total component count and simplifies the overall assembly process.
2Productivity
If traditional assembly methods are used, then component security and electrical connection reliability are ensured, but production time and fabrication cost increase
Solution Approach 1:
The bonding pads are pre-integrated onto the holder substrate during holder fabrication, before final assembly. This preliminary action ensures that electrical connection paths are established in advance, eliminating the need for complex wire bonding or separate connection steps during final assembly, thereby improving productivity while maintaining connection reliability.
Solution Approach 2:
The holder structure is designed to automatically provide electrical grounding and mechanical support when properly positioned. The integrated bonding pads self-align with corresponding pads on the circuit board, and the holder's rigid structure automatically ensures proper contact and connection without requiring additional alignment procedures or external fastening mechanisms.
3Object-affected harmful factors
If EMI shielding is implemented, then electromagnetic interference is reduced, but device complexity and fabrication cost increase
Solution Approach 1:
The EMI shielding function is merged with the existing holder structure by placing the shielding plate within the holder's cavity and connecting it to the holder's grounding system. This integration allows the shielding function to be added without requiring separate mounting structures or complex installation procedures, thus reducing EMI while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design simplifies the assembly process and reduces fabrication costs while maintaining the functionality of 3D sensing modules, enabling efficient production of 3D stereoscopic image technology components.
Implementation Method 1
the third bonding pads are bonded on and electrically connected to the second bonding pads
Implementation Method 2
an electromagnetic interference (EMI) shielding plate disposed on the concave portion of the bottom surface of the holder
Data Source
AI summary
A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.