3D Redistribution Package Layout for Compact Reliable Electronics

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing electronic packages and manufacturing methods are inadequate, resulting in excess cost, decreased reliability, relatively low performance, and package sizes that are too large.

Innovation Solution

The proposed electronic device includes a first redistribution structure with a first electronic component on one side and a first passive component on the other, with internal interconnects and encapsulants strategically placed to enhance connectivity and protection. The method involves providing substrates, internal interconnects, passive components, and encapsulants in a specific sequence to form the electronic device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional electronic packages are used, then manufacturing is simpler, but package size becomes too large

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from planar component arrangement to three-dimensional vertical stacking, placing components on both top and bottom substrates and using vertical interconnects to reduce package footprint while maintaining manufacturing feasibility through structured layering

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested packaging by placing one substrate inside another with components arranged in vertical layers, where the first substrate and second substrate are positioned with their respective components stacked vertically, reducing overall package volume

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If conventional electronic packages are used, then design is simpler, but performance becomes relatively low

Engineering Contradiction:

Improveelectronic package reliabilityVSAvoidpackage structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the electronic package into distinct functional segments: first substrate with first components, second substrate with second components, and intermediate interconnect structures, allowing independent optimization of each segment while improving overall reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediate structures including encapsulants that protect component interfaces, redistribution structures that manage signal routing, and dedicated interconnect layers that mediate between different substrate layers, enhancing reliability while managing complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If conventional electronic packages are used, then manufacturing cost is lower, but reliability decreases

Engineering Contradiction:

Improveelectronic package reliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent performs preliminary actions by pre-arranging components on substrates before final assembly, pre-forming interconnect structures, and pre-positioning encapsulants, which improves reliability through better alignment and reduces manufacturing costs by enabling batch processing

Inventive Principle:

Principle #10Preliminary action

4Reliability

If larger package size is used, then manufacturing is easier, but performance is reduced

Engineering Contradiction:

Improveelectronic package reliabilityVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent resolves the contradiction between reliability and package size by transitioning to three-dimensional vertical architecture, stacking substrates and components vertically to achieve high reliability through improved interconnect design while minimizing package footprint

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250022857A1Electronic devices and methods of manufacturing electronic devices

Publication Date: 2025.01.16 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device can include a first redistribution structure. A first electronic component can be disposed on a first side of the first redistribution structure. A first passive component can be on a second side of the first redistribution structure with the first redistribution structure between the first passive component and the first electronic component. A first internal interconnect can be adjacent a lateral side of the first redistribution structure and coupled to the first redistribution structure. A second internal interconnect can be adjacent a lateral side of the first passive component and coupled to the first redistribution structure. An antenna substrate can be disposed over a first side of the first electronic component. A second redistribution structure can be disposed over a second side of the first electronic component. Other examples and related methods are also disclosed herein.