3D RF Antenna Fabrication via Flexible Circuit Substrates

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Solution Overview

Problem

Next-generation large area multifunction active arrays for space and airborne antennas require lighter weight, lower cost, and more conformal designs, which existing technologies struggle to achieve while maintaining performance in radar and communication systems due to challenges with lightweight materials.

Innovation Solution

A process for fabricating three-dimensional radio frequency (RF) antenna structures using flexible circuit substrates with formed channels and conductive layers, integrating electrical and mechanical functions, and minimizing the number of dielectric, conductor, and adhesive layers through innovative folding and imaging techniques, resulting in a 75% weight reduction and increased rigidity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If lightweight materials are used to form antenna component structures, then weight is reduced, but manufacturing precision deteriorates

Engineering Contradiction:

Improveantenna structure weightVSAvoidantenna structure formation precision

Core Design Contradiction:

Weight of moving objectVSManufacturing precision

Solution Approach 1:

The antenna structure is divided into multiple flexible circuit substrate layers, each containing specific RF components and transmission lines. These segmented layers are formed separately with precise manufacturing processes, then assembled together to create the complete three-dimensional antenna structure, thereby maintaining manufacturing precision while using lightweight materials

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent transitions from traditional two-dimensional planar antenna structures to three-dimensional folded flexible circuit substrate structures. By utilizing the third dimension (folding multiple layers at different heights), the antenna achieves complex RF signal routing and component integration while maintaining lightweight construction through flexible substrate materials

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If traditional multilayer active panel array architecture is used, then manufacturing precision is maintained, but weight increases

Engineering Contradiction:

Improveantenna structure formation precisionVSAvoidantenna structure weight

Core Design Contradiction:

Manufacturing precisionVSWeight of moving object

Solution Approach 1:

The patent employs flexible circuit substrate layers instead of traditional rigid multilayer panel structures. These flexible substrates with integrated conductive traces and RF components replace heavy metal panels and multiple rigid dielectric layers, achieving weight reduction while maintaining precise RF signal routing through controlled impedance transmission lines formed on the flexible surfaces

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent combines multiple functions into integrated flexible circuit substrate layers: RF signal transmission, component mounting, structural support, and electromagnetic shielding are all incorporated into the same flexible substrate layers with conductive traces and ground planes, eliminating the need for separate heavy structural and functional components

Inventive Principle:

Principle #5Merging (Combining)

3Weight of moving object

If flexible circuit substrates with three dimensional channels are used, then weight is reduced and conformality is improved, but device complexity increases

Engineering Contradiction:

Improveantenna structure weightVSAvoidfabrication process complexity

Core Design Contradiction:

Weight of moving objectVSDevice complexity

Solution Approach 1:

The patent incorporates RF components, transmission lines, and ground planes directly into the flexible circuit substrate layers during the substrate fabrication process before assembly. This preliminary integration of electrical and mechanical functions into the substrate structure simplifies the overall assembly process and reduces the number of separate manufacturing steps required, thereby managing device complexity while achieving weight reduction

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The process enables the creation of ultra-lightweight, conformal antennas with improved performance by integrating microwave transmission lines and components into multilayer 3-D fluted flex circuit boards, reducing weight and increasing structural support while maintaining electrical signal routing capabilities.

Implementation Method 1

forming a first preselected pattern of three dimensional channels in the flexible circuit substrate

Methodology Applied

Scientific EffectDeformation: Deformation

Implementation Method 2

depositing a conductive layer on the formed flexible substrate

Methodology Applied

Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS9072164B2Process for fabricating a three dimensional molded feed structure

Publication Date: 2015.06.30 RAYTHEON CO

AI summary

A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.