3D RF Antenna Cavity Structure for EMI and Coupling Isolation
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Solution Overview
Problem
Antenna integration in AiP technology faces challenges such as significant insertion losses, electromagnetic interference (EMI), and mutual coupling, which degrade performance and increase complexity, especially in compact devices.
Innovation Solution
A 3-dimensional RF antenna design with a molded substrate featuring a cavity structure and conformal shield layer, along with a radiator and optional reflector, reduces mutual coupling and EMI, enhancing gain and simplifying design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If planar antenna structure is used in AiP technology, then integration and packaging is simplified, but insertion losses increase significantly
Solution Approach 1:
The patent transitions from a conventional 2D planar antenna structure to a 3D antenna structure by introducing a vertical cavity within the molded substrate. The radiator extends into this cavity, creating a three-dimensional configuration that increases the effective radiating surface area and improves radiation efficiency while maintaining compact footprint. This dimensional change allows the antenna to achieve better performance without increasing overall device complexity.
2Volume of moving object
If antenna is integrated closer to RFIC in AiP solution, then space is saved, but electromagnetic interference and mutual coupling increase
Solution Approach 1:
The patent introduces a molded substrate with a cavity as an intermediary structure between the RFIC and the antenna radiator. This substrate serves as both a mechanical support and an electromagnetic isolation medium. The cavity structure within the substrate creates electromagnetic separation, reducing mutual coupling and interference while allowing the antenna to be integrated close to the RFIC in the vertical dimension, thus saving horizontal space.
3Reliability
If 3-dimensional antenna structure is implemented, then gain and radiation efficiency are improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into a single molded substrate component: it serves as the antenna support structure, provides the cavity for the 3D radiator configuration, acts as an electromagnetic isolation medium, and provides mechanical mounting for the RFIC. This merging of functions into one integrated component achieves the 3D antenna structure with improved radiation efficiency while avoiding the manufacturing complexity of assembling multiple separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3-dimensional RF antenna achieves higher gain, easier configuration, and improved crosstalk isolation, while maintaining a compact form factor and reducing EMI interference.
Implementation Method 1
a shield layer covering the molded substrate at least at the front side surface and at the cavity walls
Implementation Method 2
a radiator layer having an active side, a portion of which emits RF waves or receives RF waves
Implementation Method 3
The packaged antenna excites not only wanted space waves but also unwanted surface waves. The propagation of surface waves and backward radiation of both space and surface waves causes undesirable coupling between the antenna and the radio chip
Data Source
AI summary
Aspects and embodiments disclosed herein include an integrated 3-dimensional radio-frequency antenna, comprising a molded substrate having a front side surface, a back side surface, and at least one cavity extending completely from the front side surface to the back side surface, the at least one cavity defining cavity walls in the molded substrate with a horizontal profile of a cross-section of the at least one cavity vertically decreasing from the front side surface towards the back side surface, a shield layer covering at least the front side surface and the cavity walls of the molded substrate, and a radiator layer including an active side, a portion of the active side that emits RF waves or receives RF waves being exposed to the cavity of the molded structure.