3D Multilayer RF Filter Circuit for Miniaturized Integration
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Solution Overview
Problem
The existing radio-frequency filters in wireless communication face challenges in achieving miniaturization and high performance, particularly with the increasing demands in 5G and Internet of Things applications.
Innovation Solution
A 3D filter circuit is designed with a multilayer structure comprising conductive layers and organic dielectric layers, forming capacitors and inductors to enhance performance and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional planar filter structures are used, then manufacturing is simple, but the filter size is large and performance is limited
Solution Approach 1:
The patent transitions from traditional planar (2D) filter structures to a three-dimensional (3D) multilayer configuration. Multiple conductive layers are stacked vertically with dielectric materials between them, creating capacitors and inductors in the vertical dimension. This dimensional change enables compact filtering elements that achieve high performance in a significantly reduced footprint while maintaining manufacturability through established PCB fabrication techniques.
2Volume of moving object
If filter miniaturization is pursued, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The filter is segmented into multiple discrete conductive layers and dielectric layers that can be manufactured and assembled separately. Each layer is fabricated with standard precision requirements, and the overall 3D structure is achieved through controlled lamination and alignment of these segments. This segmentation allows miniaturization while distributing precision requirements across multiple manageable manufacturing steps rather than requiring ultra-precise monolithic fabrication.
3Reliability
If more filtering elements are integrated, then filter performance is enhanced, but device complexity increases
Solution Approach 1:
Multiple filtering elements (capacitors, inductors, and filtering circuits) are merged into a single integrated 3D structure. Conductive layers serve dual purposes as both structural elements and functional circuit components. The multilayer configuration allows capacitors and inductors to be formed by different combinations of the same conductive layers, eliminating the need for separate discrete components and reducing overall circuit complexity while enhancing filtering performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D filter circuit achieves high-performance and miniaturized radio-frequency filters by integrating capacitors and inductors in a compact, three-dimensional arrangement.
Implementation Method 1
Each organic dielectric layer is disposed between different conductive layers. The multilayer structure is configured to form at least one capacitor.
Data Source
AI summary
Provided are a 3D filter circuit and a 3D filter. The 3D filter circuit includes a multilayer structure. The multilayer structure includes at least two conductive layers and at least one organic dielectric layer. Each organic dielectric layer is disposed between different conductive layers. The multilayer structure is configured to form at least one capacitor.