3D Sensing Camera Sliding Rail Mechanism for Expanded Depth and Width
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Solution Overview
Problem
Conventional 3D image sensing devices are limited in their ability to achieve deeper and wider image acquisitions, restricting the development and application of 3D image acquisition technology.
Innovation Solution
A 3D sensing device with a sliding rail and moving assembly that allows the infrared emitting and receiving modules, along with a color camera module, to adjust their position relative to each other, enabling broader and deeper sensing by combining color and depth information through motor-driven screws and circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a 3D image sensing device is fixed within a range of use, then the device structure is simple and stable, but the device cannot achieve deeper and wider image acquisitions
Solution Approach 1:
The patent applies the dynamics principle by transforming the fixed sensing device into a movable one. The sensing device is mounted on a moving platform that can translate along the optical axis and rotate, enabling dynamic adjustment of the sensing range. This allows the device to achieve deeper and wider image acquisitions while maintaining structural simplicity through standardized mechanical components like rails and motors.
2Adaptability or versatility
If the sensing device is made movable to expand sensing range, then the image acquisition depth and width are improved, but the device structure becomes more complex
Solution Approach 1:
The patent applies universality by designing a multi-functional moving platform that combines both translation and rotation capabilities in a single structure. This platform can perform multiple functions: adjusting sensing depth through translation, expanding sensing width through rotation, and maintaining stable operation. The integrated design avoids the need for separate mechanisms, thereby reducing overall structural complexity while enhancing adaptability.
Solution Approach 2:
The patent applies segmentation by dividing the moving platform into independent functional modules: a translation mechanism with rails and motors for depth adjustment, and a rotation mechanism for width expansion. This modular segmentation allows each component to be optimized independently and facilitates easy assembly, maintenance, and adjustment, reducing the perceived complexity of the overall system.
3Loss of information
If multiple modules (infrared emitting, infrared receiving, color camera) are positioned relative to each other on a moving platform, then comprehensive 3D sensing is achieved, but the alignment precision becomes more difficult to maintain
Solution Approach 1:
The patent applies merging by integrating the infrared emitting module, infrared receiving module, and color camera module onto a single moving platform. This consolidation ensures that all modules move together as one unit, maintaining their relative positions and alignment. The unified platform structure eliminates alignment errors that would occur with separate mounting mechanisms, thereby preserving manufacturing precision while enabling comprehensive 3D sensing with synchronized color and depth information.
Data Source
AI summary
A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.