Integrated 3D Sensing Module With VCSEL-SPAD Co-Packaging
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Solution Overview
Problem
Existing 3D sensing technologies face challenges with system complexity, increased size, and reduced integration due to separate projector and detector modules, as well as sensitivity to reflections and scattering in time-of-flight methods, and high processing requirements in structured light methods.
Innovation Solution
An integrated electronic module with a VCSEL laser diode and SPAD detector within a single package, utilizing a rigid-flex circuit board and MEMS reflectors, allows for compact 3D sensing applications by optimizing component placement and reducing dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a split projection/detection scheme with separate projector and detector modules is used, then the system can be manufactured with existing opto-mechanical solutions, but the system complexity increases and the module size increases
Solution Approach 1:
The patent combines the projector and detector into a single integrated module where the detector is positioned directly below the projector within the same package. This merging eliminates the need for separate opto-mechanical assemblies while maintaining manufacturability through standardized packaging processes.
Solution Approach 2:
The base substrate serves multiple functions: it provides mechanical support for both the projector and detector, enables electrical connections between components, and facilitates thermal management. This multi-functionality reduces the number of separate components needed, thereby reducing system complexity.
2Ease of manufacture
If a split projection/detection scheme with separate projector and detector modules is used, then the system can be manufactured with existing opto-mechanical solutions, but the module size increases
Solution Approach 1:
The detector is positioned directly beneath the projector within the same package footprint, creating a nested vertical arrangement. This allows both components to occupy the same horizontal space, significantly reducing the overall module size while maintaining separate functional zones.
Solution Approach 2:
The patent transitions from a horizontal arrangement of separate modules to a vertical integration within a single package. By stacking the detector below the projector along the vertical axis, the module achieves compact dimensions suitable for portable devices while maintaining manufacturability.
3Measurement precision
If time-of-flight approach is used for 3D sensing, then longer range with higher accuracy and less power consumption is achieved, but the system becomes sensitive to reflections and scattering phenomena
Solution Approach 1:
The patent introduces a beam splitter as an intermediary optical element that directs light from the projector through the detector while enabling separate optical paths for measurement and reference. This intermediary component helps manage unwanted reflections and scattering by controlling light propagation paths.
Solution Approach 2:
The patent replaces traditional mechanical scanning systems with a static integrated optical design using beam splitters and fixed optical paths. This substitution reduces sensitivity to mechanical misalignments and vibrations that could exacerbate reflection and scattering issues while maintaining measurement precision.
4Object-affected harmful factors
If structured light approach is used for 3D sensing, then sensitivity to reflection and scattering is reduced, but heavy processing and complex component assembly are required
Solution Approach 1:
The patent merges the projector and detector into a single integrated module with shared mechanical support and electrical connections. This consolidation simplifies component assembly by reducing the number of separate assemblies that need to be aligned and integrated, while maintaining the structured light approach's resistance to reflections and scattering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances integration and reduces costs and dimensions, enabling more efficient 3D sensing in portable devices with improved accuracy and reduced sensitivity to reflections, while maintaining high resolution and processing efficiency.
Implementation Method 1
An integrated electronic module with a VCSEL laser diode and SPAD detector within a single package
Implementation Method 2
Depth is calculated by measuring the time (direct ToF) or the phase shift (indirect ToF) between the emitted and the reflected beam
Implementation Method 3
the projector typically includes a LASER source and a micro-mirror manufactured in MEMS technology; the LASER source is oriented so that a beam is directed towards the micro-mirror, and the micro-mirror is controlled in oscillation to direct the beam towards a target
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5B
AI summary
An electronic module (2; 40; 50; 60), comprising: a substrate (2a); a covering structure (2b), coupled to the substrate to form a chamber (4). The chamber houses: an emitter (12) adapted to emit a radiation (18); a resonant reflector (10); a detector (22); and a fixed reflector (16). First and second windows (20, 26) extend through the covering structure (2b). The emitter (12), the first reflector (10) and the second reflector (16) are reciprocally arranged such that the emitted radiation generated by the emitter is received by the fixed reflector (16), is reflected towards the MEMS reflector (10), and then is reflected towards the first window, to form an output of the electronic module. The detector (22) and the second window (26) are reciprocally arranged such that an incoming radiation (24) passing through the second window (26) is received by the detector. The electronic module can be used for 3D sensing application.