3D Thermal Sensor Placement for Stacked Die Heat Management
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Solution Overview
Problem
In three-dimensional die structures, single temperature sensors are insufficient for accurately identifying heat sources due to temperature variations across the die and heat conduction between stacked dies, leading to unnecessary deactivation of non-overheating areas and potential material fatigue from excessive temperature differences.
Innovation Solution
A method involving multiple thermal sensors arranged within a three-dimensional die structure to determine partial temperature distributions, compare sensor readings, and control resource activity by throttling identified overheating resources, using a control unit to manage temperature data and issue throttle orders based on relative sensor locations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single temperature sensor is used on a die, then device complexity is reduced, but measurement precision deteriorates due to inability to accurately identify heat sources in three-dimensional die structures
Solution Approach 1:
The patent divides the temperature monitoring function into multiple segments by placing several temperature sensors at different locations on the die. Each sensor monitors a specific region, and the control logic segments the thermal management decisions based on which sensor detects overheating, enabling precise localization of heat sources while maintaining manageable system complexity.
Solution Approach 2:
The patent transitions from two-dimensional temperature monitoring (single sensor on die surface) to three-dimensional thermal sensing by placing sensors at multiple vertical levels within the stacked die structure. This dimensional expansion enables accurate identification of heat sources in the Z-direction (between stacked dies) while the control logic integrates information from all levels to make informed thermal management decisions.
2Measurement precision
If multiple temperature sensors are deployed to improve heat source identification, then measurement precision improves, but device complexity increases due to additional control logic and connection pins
Solution Approach 1:
The patent merges the control logic for multiple temperature sensors into a unified thermal management unit. Instead of implementing separate control circuits for each sensor, the system combines all sensor inputs into a single decision-making logic that evaluates temperature data from multiple locations and coordinates thermal management actions across the stacked die structure, thereby reducing overall device complexity.
Solution Approach 2:
The control logic implemented in the patent is designed to be universal and multi-functional, handling temperature monitoring, heat source identification, and thermal management control for all sensors within a single integrated system. This universal controller can adapt to different sensor configurations and die stack arrangements, reducing the need for application-specific custom logic and minimizing connection requirements.
3Loss of information
If heat conduction between stacked dies is considered, then thermal awareness improves, but unnecessary deactivation of non-overheating areas occurs
Solution Approach 1:
The patent implements local quality by making thermal management decisions specific to the location where overheating is detected. When a temperature sensor on a particular die detects high temperature, the control logic applies thermal management actions (throttling or deactivation) only to resources on that specific die, rather than affecting the entire stacked die structure. This localized approach maintains thermal awareness of heat conduction effects while preserving productivity in non-overheating areas.
Solution Approach 2:
The system continuously monitors temperature at multiple locations and uses this feedback to dynamically adjust thermal management actions. The control logic receives real-time temperature data from sensors on different dies, analyzes the thermal patterns to distinguish between localized heating and heat conduction effects, and adjusts resource allocation accordingly, preventing unnecessary deactivation while maintaining safe operating temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise identification and management of heat sources, preventing unnecessary deactivation of non-overheating areas and reducing material fatigue by accurately distributing thermal control measures across the die stack.
Implementation Method 1
obtain temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure
Implementation Method 2
heat conduction of the substrate materials may lead to heating of adjacent dies
Data Source
AI summary
The invention relates to a method for obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure determining at least a partial three-dimensional temperature distribution for said die structure and controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.