3D Depth Sensor Enclosure With Thermal Control Against Drift
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Solution Overview
Problem
Existing 3-D depth sensors fail to operate accurately in industrial environments with varying temperature and humidity conditions, leading to measurement drift and performance degradation, and are not suitable for hazardous conditions due to limitations in temperature control, air-tightness, and optical clarity.
Innovation Solution
A thermally conductive enclosure with a temperature control circuit that uses thermoelectric devices to maintain the sensor's internal temperature within an operational range, combined with an optically transparent window and airtight design to prevent condensation and ensure mechanical positioning accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sensor operates in varying temperature environments, then the sensor can be used in more industrial applications, but measurement accuracy degrades due to thermal drift
Solution Approach 1:
The patent changes the temperature parameter by introducing active thermal control through Peltier devices and thermal management structures, transforming the sensor from passive temperature acceptance to active temperature regulation, thereby maintaining measurement accuracy across varying environmental conditions
Solution Approach 2:
The patent introduces thermal management components (Peltier devices, heat sinks, thermal barriers) as intermediary elements between the sensor and the environment, which mediate the temperature interaction and protect the sensor from direct thermal fluctuations
2Measurement precision
If the sensor is cooled below ambient temperature to prevent thermal drift, then measurement stability improves, but surface condensation occurs degrading sensor performance
Solution Approach 1:
The patent applies local thermal management by differentiating between the sensor interior (cooled for stability) and exterior (warmer to prevent condensation), using thermal barriers and selective cooling zones to create different thermal qualities in different locations
Solution Approach 2:
The patent creates asymmetric thermal management where the interior and exterior of the sensor housing experience different temperature conditions, with the interior actively cooled and the exterior passively warmed through insulation and thermal barriers
3Ease of manufacture
If off-the-shelf enclosures are used for the sensor, then manufacturing cost and complexity are reduced, but the sensor cannot meet hazardous environment requirements for air-tightness and temperature control
Solution Approach 1:
The patent segments the enclosure system into modular components (housing, optical windows, thermal management modules, sealing elements) that can be independently selected and assembled, allowing standard components to be combined with specialized elements to meet hazardous environment requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes the temperature-sensitive components of 3-D sensors, reducing measurement instability and enabling accurate operation across a wide range of industrial conditions, including hazardous environments, by actively controlling temperature and minimizing condensation.
Implementation Method 1
activating at least one thermoelectric device to either cool or heat the interior of the enclosure based on whether the determined temperature is above or below the range, respectively
Implementation Method 2
The support structure may be thermally conductive. The method may further include transferring heat between the support structure and the at least one thermoelectric device.
Data Source
AI summary
A method and system for expanding the range of working environments in which a 3-D or depth sensor can operate without damaging or degrading the measurement performance of the sensor are provided. The sensor has a rigid support structure and a plurality of optoelectronic components fixedly supported on the support structure. The system includes an enclosure for enclosing the support structure and the supported optoelectronic components within an interior of the enclosure. A temperature control circuit includes a controller to monitor interior temperature within the enclosure and to regulate temperature within the enclosure to be within an operational temperature range of the sensor based on the monitored temperature.