3D Silicon Comb Probe for Deep Brain Neural Monitoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current neural probes, despite recent size reductions, lack the density and precision needed for accurate monitoring and stimulation of brain activity, particularly in 3D regions, due to their 2D design and limited electrode density, which restricts their ability to quantify individual cell behavior and interact with deep brain structures effectively.
Innovation Solution
A 3D comb probe structure with a carrier and multiple combs formed by shanks, each featuring sensing elements on their stem portions and connected to electrical contacts, allowing for high-density electrode arrays and nano-patterned features to enhance interaction and sensitivity, enabling both electrical and chemical sensing in a 3D space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If 2D electrode arrays are used in neural probes, then device simplicity is maintained, but measurement precision and resolution for monitoring brain activity are limited
Solution Approach 1:
The patent transitions from traditional 2D electrode arrays to a 3D comb probe structure with multiple shanks extending in three dimensions. This dimensional change enables electrodes to be positioned at various depths and orientations within brain tissue, significantly improving measurement precision and resolution for monitoring brain activity while maintaining manageable device complexity through modular construction
2Measurement precision
If electrode density is reduced to improve ease of manufacture, then manufacturing simplicity increases, but measurement precision and ability to quantify individual cell behavior deteriorates
Solution Approach 1:
The comb probe is segmented into multiple shanks, each containing multiple electrodes arranged in arrays. This segmentation allows for high electrode density on each individual shank while the overall manufacturing process remains manageable through modular fabrication techniques. Each shank can be manufactured separately and then assembled into the complete probe structure
Solution Approach 2:
By arranging electrodes in three-dimensional comb structures rather than flat 2D arrays, the patent achieves high electrode density without proportionally increasing manufacturing complexity. The comb configuration allows systematic placement of numerous electrodes along multiple shanks, enabling quantification of individual cell behavior while using established microfabrication techniques
3Adaptability or versatility
If 2D probe design is used, then device simplicity is maintained, but ability to interact with deep brain structures and stimulate targeted regions deteriorates
Solution Approach 1:
The comb probe extends electrodes in three dimensions with shanks projecting from a common base, enabling interaction with deep brain structures at multiple depths and lateral positions simultaneously. This 3D configuration provides versatility for stimulating and sensing in targeted regions while maintaining a relatively simple overall structure that can be inserted through a single access point
Solution Approach 2:
The comb probe structure features shanks nested from a common base portion, with electrodes arranged hierarchically along each shank. This nested configuration allows multiple sensing and stimulation points to be contained within a compact probe structure, enhancing adaptability for deep brain interaction while minimizing the invasive footprint during insertion
Data Source
AI summary
A three-dimensional (3D) comb probe structure includes a carrier, a plurality of combs arranged in the carrier and spaced apart from one another, a plurality of shanks forming the combs, each shank including a base portion and a stem portion extending from the base portion, wherein sets of the shanks are joined together by the base portions thereof to form a respective comb, and a plurality of sensing elements disposed along the stem portion of each of the shanks and electrically connected to electrical contacts disposed at respective ones of the base portions. The sensing elements can include nanopatterned features on surfaces thereof forming a non-random topography.


