3D Stack Defect Detection Using Light Scattering
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Solution Overview
Problem
The resolution of defect detection in 3D stacks using ultrasonic waves decreases as the stack height increases and bonding pitch narrows, leading to increased errors in defect detection.
Innovation Solution
A detection apparatus utilizing a light source that emits first light at a slanted angle to a 3D stack surface and a light detector positioned vertically above to receive scattered light from defects, or an ultrasonic emission source and detector to detect scattered waves, with wavelengths greater than the bonding pitch, enhancing detection sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If ultrasonic waves are used to detect defects in 3D stack, then defect detection is possible, but detection resolution decreases as stack height increases and bonding pitch decreases
Solution Approach 1:
The patent replaces the ultrasonic wave-based detection system with a light-based detection system. Specifically, it uses a light source to emit light toward the 3D stack and a light detector to receive scattered light from defects, substituting mechanical ultrasonic waves with optical waves for higher resolution defect detection in tall stacks with small bonding pitches
Solution Approach 2:
The patent changes the detection wavelength parameter to be greater than the bonding pitch between stacked material layers. By selecting light wavelengths that exceed the bonding pitch dimension, the system achieves improved detection resolution for defects in regions with small bonding pitches, directly addressing the limitation of ultrasonic methods
2Reliability
If ultrasonic waves are used to detect defects in 3D stack, then defect detection is possible, but detection error increases as stack height increases and bonding pitch decreases
Solution Approach 1:
The patent replaces the ultrasonic wave-based detection system with a light-based detection system. Specifically, it uses a light source to emit light toward the 3D stack and a light detector to receive scattered light from defects, substituting mechanical ultrasonic waves with optical waves for higher resolution defect detection in tall stacks with small bonding pitches
Solution Approach 2:
The patent changes the detection wavelength parameter to be greater than the bonding pitch between stacked material layers. By selecting light wavelengths that exceed the bonding pitch dimension, the system achieves improved detection resolution for defects in regions with small bonding pitches, directly addressing the limitation of ultrasonic methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus increases detection accuracy and sensitivity for defects in 3D stacks by effectively identifying and locating bonding interface defects using light or ultrasonic waves, improving the manufacturing process by reducing defect occurrence.
Implementation Method 1
a light source configured to radiate first light to a first region of a surface of the 3D stack; and a light detector configured to receive second light emitted from a second region of the surface of the 3D stack, based on the first light being emitted to the first region
Implementation Method 2
an ultrasonic emission source that radiates ultrasonic waves to a first region of a surface of the 3D stack; and an ultrasonic detector configured to receive scattered waves from a second region of the surface of the 3D stack, based on the radiated ultrasonic waves being radiated to the first region
Data Source
AI summary
A detection apparatus and method for detecting defects in a 3D stack are provided. The detection apparatus may include a light source configured to radiate first light to a first region of a surface of the 3D stack, and a light detector configured to receive second light emitted from a second region of the surface of the 3D stack, based on the first light being emitted to the first region, wherein the second region is located between the first region and the light source.