3D Stacked Dielectric Bandpass Filter for UWB Miniaturization
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Solution Overview
Problem
Conventional bandpass filters (BPFs) for ultra-wide band (UWB) communication have narrow stop bands and are too large for practical applications, making them unsuitable for miniaturization in communication products.
Innovation Solution
A 3D bandpass filter configuration using multiple dielectric substrates with specific patterns, including ground patterns, stripline patterns, and coupled line patterns, to enhance filtering capabilities and reduce size by forming patterns in a stacked structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional microstrip patterns are formed on a dielectric substrate, then the BPF can be manufactured with simple structure, but the stop band becomes narrow and the size becomes too large
Solution Approach 1:
The patent transitions from conventional two-dimensional microstrip patterns on a single substrate to three-dimensional patterns formed by stacking multiple dielectric substrates. The filter pattern extends across multiple layers with conductive patterns on front and rear surfaces, creating a volumetric structure that achieves compact size while maintaining manufacturing feasibility through standard lamination and via hole processes
2Ease of manufacture
If conventional microstrip patterns are formed on a dielectric substrate, then the BPF can be manufactured with simple structure, but the stop band becomes narrow
Solution Approach 1:
The patent achieves wide stop band by extending the filter pattern into the third dimension through multiple substrate stacking. The resonant cavities formed by the filter pattern and ground patterns on front and rear surfaces create enhanced frequency selectivity, while the via holes providing electrical connection between layers enable the three-dimensional resonant structure that broadens the stop band
Solution Approach 2:
The patent employs nested ground patterns where a ground pattern on the front surface and another ground pattern on the rear surface enclose the filter pattern, creating resonant cavities. This nested configuration of conductive patterns across multiple layers enhances the filtering characteristics and widens the stop band while maintaining manufacturing simplicity
3Area of stationary object
If the BPF is miniaturized for product application, then the device size is reduced, but the stop band becomes narrow and filtering performance deteriorates
Solution Approach 1:
The patent achieves miniaturization by forming the filter pattern as a three-dimensional structure spanning multiple dielectric substrates. The volumetric resonant cavities created by the stacked configuration provide enhanced frequency selectivity in a compact footprint, allowing the filter to maintain wide stop band characteristics while occupying minimal space for product integration
Data Source
AI summary
A bandpass filter (BPF) configured in 3-D structures for filtering signals of ultra wide bands is disclosed, the BPF comprising sequentially stacked first to fourth dielectric substrates, wherein the first dielectric substrate is formed at a bottom surface thereof with a first ground pattern, the second dielectric substrate is formed at an upper surface thereof with a second ground pattern, and a stripline pattern is formed between the first and second dielectric substrates. The fourth dielectric substrate is formed thereon with a filter pattern and input/output coupled line patterns.