3D Stacked Electronic Device Passive Component Layout
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Solution Overview
Problem
Power management integrated circuits (PMICs) face challenges in miniaturization due to the need for bulky passive components for high-speed data communication, which increases package size and reduces layout design flexibility.
Innovation Solution
The electronic device configuration includes a first and second circuit structure with passive devices disposed over and adjacent to each other, allowing for a non-power circuit region and power circuit regions to be positioned closer to the periphery, thereby reducing the size and optimizing the layout by shortening power paths and minimizing voltage drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If bulky passive components are used for high-speed data communication, then communication performance is improved, but package size increases and layout flexibility is reduced
Solution Approach 1:
The patent transitions from planar 2D layout to three-dimensional vertical stacking, placing passive components on different elevation levels above the circuit board. This allows high-speed data communication components to be positioned vertically rather than horizontally, reducing the footprint area while maintaining signal integrity and communication performance.
Solution Approach 2:
The patent divides the package into multiple elevation levels or layers, with different passive components positioned at different heights above the circuit board. This segmentation allows independent optimization of each component's position and reduces interference between components, enabling smaller package size while supporting high-speed communication requirements.
2Adaptability or versatility
If multiple passive components are integrated into the package, then power control functionality is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple passive components and circuit structures into a single integrated three-dimensional package assembly. By merging these components into one unified structure with vertical stacking, the patent reduces the number of separate packages and interconnections required, thereby reducing overall device complexity while maintaining enhanced power control functionality.
Solution Approach 2:
The patent designs the passive components and circuit structures to serve multiple functions simultaneously - for example, passive components positioned at different elevations can serve both as electrical components and as structural elements that support other components. This multi-functionality reduces the overall complexity by eliminating redundant structures.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.