3D Stacked Module Packaging for Higher Integration Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing module technologies face challenges in reducing size while increasing integration and functionality, particularly in mobile devices and automotive applications, due to limited space and inefficient connection methods.
Innovation Solution
A module design involving stacked components with embedded electronics, using rewiring layers and eutectic bonding to connect and integrate multiple components without additional solder joints, allowing for increased integration in the third dimension and reduced parasitic inductances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional module designs with separate components and solder joints are used, then ease of manufacture is maintained, but module size cannot be reduced further and integration density is limited
Solution Approach 1:
The patent merges multiple discrete components (electronic components, interconnect structures, and substrate elements) into a single integrated module component. The components are embedded directly into the substrate material during manufacturing, eliminating the need for separate mounting and soldering processes. This merging approach reduces overall module volume while increasing integration density, as components occupy space within the substrate rather than requiring additional assembly space.
Solution Approach 2:
The patent transitions from planar integration (2D) to three-dimensional integration (3D) by embedding components within the substrate volume. The interconnect structures extend vertically through the substrate, creating multiple interconnection layers. This dimensional change allows components to be stacked and interconnected in the third dimension, significantly increasing integration density without proportionally increasing module footprint.
2Adaptability or versatility
If additional solder joints and connection structures are added to increase functionality, then device versatility is improved, but manufacturing complexity and space requirements increase
Solution Approach 1:
The substrate is designed as a universal platform that can embed various types of electronic components (semiconductor devices, passive components, antennas) and provide multiple interconnection methods (conductive traces, vias, through-holes). This universal design allows the same module architecture to accommodate different component configurations and functionalities without requiring separate manufacturing processes for each component type, thereby improving device versatility while maintaining manufacturing simplicity.
Solution Approach 2:
Interconnect structures (conductive traces, vias, and connection points) are pre-formed within the substrate material before components are embedded. The substrate is manufactured with integrated routing paths and connection structures already in place, eliminating the need for post-assembly soldering or additional connection steps. This preliminary action reduces manufacturing complexity while enabling versatile component interconnections.
3Stability of the object's composition
If components are mounted with vertical gaps and additional stiffeners are added, then mechanical stability is improved, but module volume increases
Solution Approach 1:
The patent embeds interconnect structures and support elements within the substrate volume rather than adding them as external additions. The conductive traces, vias, and mechanical support features are nested inside the substrate material, providing structural stability and electrical interconnection without increasing the module's external dimensions. This nesting approach maintains mechanical stability while minimizing volume increase.
4Adaptability or versatility
If signal paths are lengthened to accommodate additional components, then device functionality is improved, but parasitic inductances increase and power consumption rises
Solution Approach 1:
The patent uses three-dimensional interconnect structures with vertical vias and multiple interconnection layers to create short signal paths between components stacked in the Z-direction. By routing signals vertically through the substrate rather than horizontally across the surface, the patent minimizes signal path length despite accommodating multiple components. This dimensional approach reduces parasitic inductances and power consumption while maintaining enhanced device functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher integration density, reduced space requirements, and improved filter properties with short signal paths and low power consumption, facilitating the use of various components and simplifying manufacturing processes.
Implementation Method 1
At least one of the module components has, on a side facing the other module component, a rewiring layer which has a metal layer via which the module components are electrically contacted with one another
Implementation Method 2
The lower and upper module components are stacked one above the other and the lower and upper module components are electrically contacted with one another and are mechanically connected to one another
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a module, which has a lower module part (1), which has a material (3) into which at least one first component (4) is embedded, and an upper module part (2), which has a material (3) into which at least one second component (16) is embedded. The upper module part (2) and the lower module part (1) are stacked one over the other, wherein the lower module part and the upper module part (2) are brought into electrical contact with each other and are mechanically connected to each other. The invention further relates to a simple and economical method for producing a plurality of modules. By means of the invention, the modules can be miniaturized in area and height and/or higher integration can be achieved by means of 3-D packaging.