3D System-Level Packaging for High Integration and Reliability
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Solution Overview
Problem
Current IC packaging technologies face challenges in achieving high integration, miniaturization, and reliability as IC chip sizes decrease and integration increases, limiting the performance and functionality of electronic systems.
Innovation Solution
A 3D system-level packaging method and structure that involves a packaging substrate with multiple functional surfaces and layers, including flip package layers and wiring and package layers, with specific layers such as flip mounting, underfill, sealant, and wiring layers, and connection balls on the substrate to enhance integration and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If IC chip size decreases and integration degree increases, then system functionality and performance improve, but packaging integration degree and reliability become insufficient
Solution Approach 1:
The patent transitions from traditional 2D planar packaging to 3D vertical packaging by stacking multiple functional layers (substrate, mounting layers, wiring layers, sealant layers) vertically. This dimensional change enables higher integration density while maintaining reliability through structured layering and interconnection schemes.
Solution Approach 2:
The patent implements nested packaging structures where multiple mounting layers are stacked within a single packaging substrate. Each layer contains functional components and wiring, with layers nested vertically one above another, connected through vertical interconnects, achieving high integration without compromising structural integrity.
2Volume of moving object
If system-level packaging integration degree is improved, then miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the packaging system into distinct functional segments: substrate layer, multiple mounting layers (each with components and wiring), sealant layers, and connection structures. This segmentation allows each layer to be manufactured and prepared separately before assembly, reducing overall manufacturing complexity despite the 3D integrated structure.
Solution Approach 2:
The packaging substrate and mounting layers are designed with multi-functionality, serving both as structural support and as interconnection carriers. The wiring layers and sealant layers simultaneously provide electrical connectivity, mechanical support, and protection, reducing the need for separate dedicated structures.
3Manufacturing precision
If dense pad populations are implemented for high precision, then manufacturing precision improves, but device complexity increases
Solution Approach 1:
The patent resolves pad alignment challenges by transitioning from 2D planar routing to 3D vertical routing. Dense pad populations on each mounting layer are connected through vertical interconnects to corresponding pads on other layers, achieving high precision alignment without requiring excessively complex 2D wiring patterns.
Solution Approach 2:
The substrate and wiring layers act as intermediaries that facilitate precise alignment between pads on different mounting layers. The structured wiring layers provide guided interconnection paths that simplify the alignment process compared to direct pad-to-pad connections.
Data Source
AI summary
A 3D system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least one flip package layer on the first functional surface of the packaging substrate and forming at least one wiring and package layer on the flip package layer. The flip package layer is formed by subsequently forming a flip mounting layer, an underfill, a sealant layer, and a wiring layer; and the wiring and package layer is formed by subsequently forming a straight mounting layer, a sealant layer, and a wiring layer. Further, the method includes planting connection balls on the second functional surface of the packaging substrate.