3D Terminal Shape Evaluation for Electronic Component Flatness
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Solution Overview
Problem
Existing electronic component inspection methods fail to accurately evaluate flatness and terminal shape, leading to improper mounting that is only detected after circuit assembly, resulting in entire circuit failure.
Innovation Solution
An electronic component evaluation method and device that uses 3D imaging to set reference points on terminals, determining their shape and position, and compares these against preset specifications to classify components as good or defective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods are used, then inspection speed is maintained, but measurement precision of flatness and terminal shape is insufficient
Solution Approach 1:
The patent transitions from conventional 2D imaging to 3D imaging to measure terminal height and flatness. By capturing images from multiple angles (front and side views) and processing them to extract three-dimensional information, the system achieves precise measurement of terminal dimensions and component flatness without requiring complex mechanical measurement devices.
Solution Approach 2:
The patent creates virtual copies of the electronic component through 3D imaging and processing. By generating virtual three-dimensional models from captured images and calculating virtual height information, the system eliminates the need for physical contact measurement while achieving high precision in terminal shape and flatness evaluation.
2Manufacturing precision
If comprehensive terminal evaluation is performed, then manufacturing precision is improved, but inspection time increases
Solution Approach 1:
The patent performs preliminary 3D modeling and virtual measurement calculations during the inspection process. By pre-processing images to create virtual three-dimensional models and calculating terminal height and flatness data before final evaluation, the system enables comprehensive measurement without requiring multiple separate inspection steps, thus reducing total inspection time.
Solution Approach 2:
The patent combines multiple measurement functions (terminal height, terminal shape, component flatness) into a single integrated inspection process. By simultaneously extracting multiple parameters from the same set of captured images through 3D processing, the system achieves comprehensive evaluation without proportionally increasing inspection time.
3Reliability
If flatness is detected with higher accuracy, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement systems with optical imaging and computational processing. Instead of using mechanical sensors or contact-based measurement devices to detect flatness, the system uses 3D camera imaging and virtual model processing to calculate flatness data, achieving high reliability while avoiding mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise evaluation of individual terminals' flatness and shape, preventing improper mounting and ensuring reliable assembly by identifying defects early in the inspection stage.
Implementation Method 1
laser light is radiated on the electronic component from a side of the glass substrate. The height measurement device measures a terminal height by concentrating the reflected light reflected by a terminal of the electronic component
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
An electronic component evaluation method of evaluating a state of an electronic component 5 includes acquiring reference point information (step S501), with respect to at least one of terminals 511 to 518, reference point information including at least one of position information and first height information of a plurality of corresponding reference points Pm1 to Pm32 on the terminal from imaging data obtained by image-capturing the electronic component 5 including a component body 51 and a plurality of terminals 511 to 518 attached to the component body 51, and determining a state according to a shape of the electronic component 5 based on a plurality of pieces of the reference point information (step S502).