3D Textured Electronic Housing for Visual Depth and Grip

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Solution Overview

Problem

Existing electronic device housings fail to meet user aesthetic requirements for visual impact and personalization, lacking a strong stereoscopic effect and fashionable appearance.

Innovation Solution

The electronic device housing features millimeter-scale three-dimensional textures on its surfaces, providing a strong visual and tactile stereoscopic effect with anti-slip performance, achieved through a hot forging process that forms these textures on a glass or ceramic substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If traditional 2.5D or 3D housing designs with gradient colors are used, then the housing can be manufactured with existing processes, but the visual impact and aesthetic appeal are insufficient to meet user requirements

Engineering Contradiction:
Improvehousing appearanceVSAvoidaesthetic requirements
Core Design Contradiction:
ShapeVSAdaptability or versatility

Solution Approach 1:

The patent transitions from traditional 2.5D/3D gradient color designs to true 3D millimeter-scale textures on the housing surface. This dimensional evolution creates macroscopic visual effects that were previously unachievable, providing strong stereoscopic impact and meeting diverse aesthetic requirements through texture patterns rather than just color gradients.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent applies millimeter-scale 3D textures to specific regions or the entire housing surface, creating localized areas of enhanced visual impact. This allows different parts of the housing to have different texture characteristics, enabling customized aesthetic designs while maintaining manufacturing efficiency.

Inventive Principle:
Principle #3Local quality

2Shape

If complex textures are added to the housing surface to enhance visual impact, then aesthetic requirements are met, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvesurface textureVSAvoidmanufacturing process
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The patent combines the texture formation process with the existing housing manufacturing process. By integrating millimeter-scale 3D texture creation into the current production line, the patent avoids adding separate complex manufacturing steps, thus achieving enhanced surface textures without significantly increasing manufacturing process complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Shape

If millimeter-scale 3D textures are formed on the housing surface, then visual and tactile stereoscopic effects are enhanced, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvesurface textureVSAvoidtexture formation precision
Core Design Contradiction:
ShapeVSManufacturing precision

Solution Approach 1:

The patent specifies that the 3D textures have millimeter-scale dimensions (macroscopic level), which is significantly larger than micro-scale textures. This parameter change in texture size makes the textures easier to manufacture with existing precision capabilities while still providing strong visual and tactile stereoscopic effects, thereby reducing manufacturing precision requirements compared to micro-scale textures.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The housing offers a visually and tactilely striking appearance, enhanced user experience, and improved anti-slip performance, while being cost-effective and suitable for industrial production.

Implementation Method 1

achieved through a hot forging process that forms these textures on a glass or ceramic substrate

Methodology Applied
Scientific EffectHot forging: Heating

Data Source

PatentEP4050869B1Electronic device housing and manufacturing method therefor, and electronic device
Publication Date: 2025.12.24 GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
  • EP4050869B1 patent drawingFigure 1~4
  • EP4050869B1 patent drawingFigure 5~7
  • EP4050869B1 patent drawingFigure 8~11

AI summary

Provided are an electronic device housing and a manufacturing method therefor, and an electronic device. The electronic device housing comprises: a housing body, wherein the housing body comprises a bottom wall and at least one side wall connected to the bottom wall, an outer surface of the bottom wall is a flat surface or a curved surface, an outer surface of the side wall is a curved surface, and at least a part of the surface of at least one of the bottom wall and the side wall is provided with a millimeter-scale three-dimensional texture.