3D Thermal Imaging Alignment for Real-Time Defect Detection
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Solution Overview
Problem
Current technologies lack the capability to simultaneously acquire and merge 3D point cloud data with thermal images, which is essential for applications requiring real-time defect detection and integrity assessment in manufacturing and pipeline inspection.
Innovation Solution
A system comprising a 3D scanner, thermal imaging device, and processing core that captures and aligns 3D point cloud data with thermal images, assigning thermal data to each point of the cloud using algorithms like GNN and neural networks to generate immediate 3D thermal images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple scanning devices are utilized to achieve geometrical information, then the geometrical data acquisition capability is improved, but the thermal reading integration capability deteriorates
Solution Approach 1:
The patent combines a 3D scanner and a thermal imaging device into a single integrated system with a common coordinate system. The 3D scanner captures geometrical point cloud data while the thermal imaging device captures thermal readings, and both datasets are merged through coordinate transformation to create unified 3D thermal models that include both geometrical and thermal information.
Solution Approach 2:
The integrated system performs multiple functions simultaneously: it acquires geometrical information through the 3D scanner, captures thermal readings through the thermal imaging device, and processes both datasets to generate comprehensive 3D thermal models. This multi-functional approach eliminates the need for separate scanning devices and post-processing integration.
2Ease of manufacture
If 3D point cloud data and thermal images are captured separately, then the data acquisition simplicity is improved, but the real-time defect detection capability deteriorates
Solution Approach 1:
The system performs continuous simultaneous acquisition of both 3D point cloud data and thermal images during a single scanning operation. The 3D scanner and thermal imaging device operate concurrently, capturing geometrical and thermal information in real-time without interruption or separate processing steps, enabling immediate defect detection.
3Manufacturing precision
If thermal image data is assigned to each point of the point cloud, then the 3D thermal image fidelity is improved, but the data processing complexity deteriorates
Solution Approach 1:
The patent introduces a coordinate system as an intermediary framework to bridge the 3D point cloud data and thermal image data. By transforming both datasets into a common coordinate system, the system enables precise assignment of thermal readings to corresponding spatial points without complex direct mapping algorithms, simplifying the overall processing while maintaining high fidelity.
Data Source
AI summary
A three-dimensional thermal (3D) thermal imaging system including a 3D scanner configured to capture 3D point cloud data of a 3D object; a thermal imaging device configured to capture a thermal image of the 3D device; and a processing core configured to align the 3D point cloud data and the thermal image and to assign thermal image data from pixels of the thermal image to each point of the three-dimensional point cloud data. A method for 3D thermal imaging including capturing three-dimensional point cloud data of a 3D object using a 3D scanner, capturing a thermal image of the 3D device using a thermal imaging device, aligning the 3D point cloud data and the thermal image using a processing core, and assigning thermal image data from pixels of the thermal image to each point of the 3D point cloud data using the processing core to create a 3D thermal image.