3D Thin-Film Layer Stacks Using Offset Shadow Mask Deposition
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Solution Overview
Problem
Conventional solid-state device fabrication methods face challenges in efficiently utilizing non-planar substrates, leading to complex and costly processes for forming multi-layer devices with enhanced surface area and performance.
Innovation Solution
A method involving a common shadow mask is used to form multi-layer solid-state devices on substrates with non-planar surfaces, allowing for offset electrode arrangements and intervening layers that conform to the substrate geometry, simplifying the fabrication process and enabling enhanced performance by increasing surface area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional fabrication methods are used on non-planar substrates, then manufacturing precision is maintained, but device complexity and fabrication cost increase significantly
Solution Approach 1:
The fabrication process is segmented into discrete deposition steps, each forming a specific layer (electrode layer, intervening layer, electrode layer) in sequence. The shadow mask is repositioned between steps to create the offset pattern, breaking down the complex non-planar fabrication into manageable segments that maintain precision while reducing overall process complexity
Solution Approach 2:
A shadow mask serves as an intermediary tool to define the offset pattern during deposition. The mask is positioned at specific lateral offsets relative to the substrate during different deposition steps, acting as a mediator that translates the design pattern into the physical layer structure without requiring complex alignment procedures
2Ease of manufacture
If planar substrates are used, then fabrication process is simple, but surface area and device performance are limited
Solution Approach 1:
The invention transitions from planar (2D) to non-planar (3D) substrate utilization by creating offset layers at different lateral positions. This dimensional change allows the device to exploit the third dimension (vertical stacking with lateral offset) to increase effective surface area and active volume without complicating the fundamental fabrication approach
Solution Approach 2:
Multiple functional layers are nested vertically in a stack configuration, with each layer offset laterally from the others. This nesting approach packs more functional material into a compact vertical structure, effectively increasing the device's active surface area and performance while maintaining a compact footprint
3Reliability
If offset electrode arrangements are implemented, then device performance is enhanced, but fabrication complexity increases
Solution Approach 1:
The fabrication employs periodic deposition cycles where the shadow mask is repeatedly positioned at offset locations to form alternating electrode and intervening layers. This periodic repositioning creates the offset pattern systematically, enhancing device performance through consistent layer alignment while keeping the fabrication process methodical and manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in devices with improved performance and reduced fabrication complexity, enabling the creation of energy storage, electro-optic, and sensing devices with increased efficiency and cost-effectiveness.
Implementation Method 1
depositing at least a portion of a first electrode over a first surface of a substrate using a first shadow mask in a first position with respect to the substrate
Data Source
AI summary
A solid-state device includes a substrate with a stack of constituent thin-film layers that define an arrangement of electrodes and intervening layers. The constituent layers can conform to or follow a non-planar surface of the substrate, thereby providing a 3-D non-planar geometry to the stack. Fabrication employs a common shadow mask moved between lateral positions offset from each other to sequentially form at least some of the layers in the stack, whereby layers with a similar function (e.g., anode, cathode, etc.) can be electrically connected together at respective edge regions. Wiring layers can be coupled to the edge regions for making electrical connection to the respective subset of layers, thereby simplifying the fabrication process. By appropriate selection and deposition of the constituent layers, the multi-layer device can be configured as an energy storage device, an electro-optic device, a sensing device, or any other solid-state device.