3D TSV Inductor Structure for Low-Loss 5G RF Filters
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Solution Overview
Problem
Integrated inductors in mobile RF transceivers suffer from high insertion loss and low quality (Q)-factors, particularly in 5G NR broadband FR1 filters, due to their large area consumption and reduced magnetic linkage.
Innovation Solution
A 3D inductor design using a bundle of micro-through substrate vias (TSVs) is implemented, which includes a first plurality of micro-TSVs within a substrate, with traces on opposite surfaces coupled to the ends of the micro-TSVs, enhancing magnetic linkage and reducing space between micro-TSVs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated inductors are used in mobile RF transceivers, then filtering and resonance suppression functions are achieved, but insertion loss increases and Q-factor decreases
Solution Approach 1:
The patent transitions from planar 2D inductor designs to three-dimensional 3D inductor structures using through-substrate vias (TSVs). This dimensional change enables vertical magnetic flux paths through the substrate, significantly improving magnetic linkage and reducing insertion loss while maintaining the required filtering and resonance suppression functions.
Solution Approach 2:
The patent employs composite structures combining conductive TSVs, magnetic materials in the substrate, and planar traces to create a hybrid inductor design. This composite approach enhances magnetic coupling efficiency and reduces energy loss compared to conventional single-material planar inductors.
2Reliability
If integrated inductors are used in mobile RF transceivers, then filtering and resonance suppression functions are achieved, but Q-factor decreases
Solution Approach 1:
The patent transitions from planar 2D inductor designs to three-dimensional 3D inductor structures using through-substrate vias (TSVs). This dimensional change enables vertical magnetic flux paths through the substrate, significantly improving magnetic linkage and reducing insertion loss while maintaining the required filtering and resonance suppression functions.
Solution Approach 2:
The patent employs composite structures combining conductive TSVs, magnetic materials in the substrate, and planar traces to create a hybrid inductor design. This composite approach enhances magnetic coupling efficiency and reduces energy loss compared to conventional single-material planar inductors.
3Device complexity
If conventional inductor designs are used, then device complexity is reduced, but area consumption increases
Solution Approach 1:
The patent transitions from planar 2D inductor designs to three-dimensional 3D inductor structures using through-substrate vias (TSVs). This dimensional change enables vertical magnetic flux paths through the substrate, significantly improving magnetic linkage and reducing insertion loss while maintaining the required filtering and resonance suppression functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D inductor design significantly improves the Q-factor of inductors, reducing insertion loss and increasing magnetic linkage, thereby enhancing the performance of 5G NR broadband FR1 filters.
Implementation Method 1
enhancing magnetic linkage and reducing space between micro-TSVs
Data Source
AI summary
A three dimensional (3D) inductor is described. The 3D inductor includes a first plurality of micro-through substrate vias (TSVs) within a first area of a substrate. The 3D inductor also includes a first trace on a first surface of the substrate, coupled to a first end of the first plurality of micro-TSVs. The 3D inductor further includes a second trace on a second surface of the substrate, opposite the first surface, coupled to a second end, opposite the first end, of the first plurality of micro-TSVs.