3D Vapor Chamber Assembly With Continuous Capillary Structure

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Solution Overview

Problem

The existing methods for forming three-dimensional vapor chambers are complex and limit the number of suppliers and the type of usable air fins to low-performance flat fins, making it difficult to effectively dissipate heat from electronic components.

Innovation Solution

A method involving two separate parts, an evaporator and a condenser, connected by a capillary intermediate structure and hermetically sealed, allowing for the formation of a 3D-vapor chamber that can be easily manufactured and effectively dissipate heat, with the option to enhance cooling using freely designed air fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the vapor chamber is assembled directly in three-dimensional shape with capillary structure running from sides to top, then the capillary structure continuity is ensured, but the manufacturing process becomes complex and limits the number of suppliers

Engineering Contradiction:
Improvecapillary structure continuityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The vapor chamber is divided into multiple separate components (base plate, side walls, capillary structures) that are manufactured independently and then assembled. This segmentation allows each component to be produced using standard manufacturing processes, reducing overall manufacturing complexity while maintaining capillary structure continuity through precise assembly interfaces.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the vapor chamber is assembled directly in three-dimensional shape with capillary structure running from sides to top, then the capillary structure continuity is ensured, but the type of usable air fins is limited to low performance flat fins

Engineering Contradiction:
Improvecapillary structure continuityVSAvoidair fin design flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

By separating the vapor chamber into modular components, the design allows for greater flexibility in configuring air fins. Different fin geometries (including three-dimensional fins) can be attached to the base plate or side walls without compromising the integrity of the capillary structure, enabling optimization of heat dissipation performance.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If standard assembly methods are used for three-dimensional vapor chamber, then the manufacturing process is established, but it limits the number of suppliers and increases production complexity

Engineering Contradiction:
Improvemanufacturing process standardizationVSAvoidsupplier availability and production efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The vapor chamber design uses standardized, separable components that can be manufactured using conventional processes. This approach enables multiple suppliers to produce different components, increasing supply chain flexibility and production efficiency while maintaining assembly simplicity through standardized interfaces.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for a reliable and effective heat dissipation from electronic components, enabling a broad application range with high cooling capacity and flexibility in air fin design, avoiding the complexity of traditional manufacturing processes.

Implementation Method 1

a capillary structure for guiding liquid water... the capillary structure, between the evaporator... and the condenser... the liquid coming back from the condenser must be allowed to spread horizontally in the evaporator

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

the first part forms an evaporator... for dissipating heat from an electronic component... water vapor which is present in the inner volume

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 3

the second part forms a condenser... water vapor which is present in the inner volume may condense... heat dissipation from electronic components

Methodology Applied
Scientific EffectCondensation: Condensation

Data Source

PatentUS11197392B2Method of forming a 3D-vapor chamber
Publication Date: 2021.12.07 ABB (SCHWEIZ) AG
  • US11197392B2 patent drawing
  • US11197392B2 patent drawing
  • US11197392B2 patent drawing

AI summary

The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.