3D Vapor Chamber Bonding Structure to Prevent Solder Intrusion

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Solution Overview

Problem

Existing three-dimensional vapor chamber structures face issues with loosening of joints due to vibration during assembly or transportation, and low-melting-point solder entering the cavity, which obstructs the working fluid's transmission path, reducing heat conduction and dissipation performance.

Innovation Solution

A three-dimensional vapor chamber bonding structure with a housing comprising a first and second shell plate, through-holes with recessed grooves, and heat pipes joined via laser welding and soldering, along with a capillary member and working fluid, preventing solder intrusion and ensuring a strong, reliable bond.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If solder such as copper paste or tin paste is used to join heat pipes and vapor chamber, then the bonding strength is improved, but the solder is prone to loosening due to vibration during assembly or transportation

Engineering Contradiction:

Improvebonding strengthVSAvoidjoint stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent replaces traditional mechanical joining methods (soldering with copper paste or tin paste) with laser welding technology. This substitution eliminates the loosening problem caused by vibration during assembly or transportation, as laser welding creates a more stable and vibration-resistant joint compared to conventional soldering methods.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the joining parameters by using laser welding instead of conventional soldering. This parameter change involves transitioning from a chemical bonding process (soldering) to a thermal melting process (laser welding), which produces a stronger and more vibration-resistant joint while preventing solder from entering the cavity.

Inventive Principle:

Principle #35Parameter changes

2Strength

If solder such as copper paste or tin paste is used to join heat pipes and vapor chamber, then the bonding strength is improved, but the solder can enter the cavity and obstruct the transmission path of working fluid

Engineering Contradiction:

Improvebonding strengthVSAvoidcavity cleanliness

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The patent replaces conventional soldering with laser welding technology. This substitution eliminates the risk of solder entering the cavity and obstructing the working fluid transmission path, as laser welding does not involve paste materials that could migrate into the sealed cavity space.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and eliminates the solder paste material from the joining process. By using laser welding instead of soldering, the harmful factor (solder paste) is completely removed from the system, preventing it from entering the cavity and blocking the working fluid path.

Inventive Principle:

Principle #2Taking out (Extraction)

3Temperature

If conventional soldering process is used, then the heat conduction performance is achieved, but the working fluid transmission path is obstructed by solder

Engineering Contradiction:

Improveheat conduction performanceVSAvoidworking fluid path clarity

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent replaces conventional soldering with laser welding technology. This substitution maintains heat conduction performance through the heat-affected zone of the weld while completely preventing solder material from entering and obstructing the working fluid transmission path in the cavity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure maintains an unobstructed working fluid path and enhances thermal stability, minimizing deformation and ensuring robust heat conduction and dissipation performance.

Implementation Method 1

each of the heat pipes is joined to the second shell plate through the flange and a weldment within the recessed groove

Methodology Applied

Scientific EffectLaser welding: Laser Beam Welding

Implementation Method 2

The capillary member is disposed within the cavity and adheres to the housing. The working fluid is contained in the cavity

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 3

achieving rapid heat conduction and heat dissipation performance through the phase change between vapor and liquid

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS20260055969A1Three-dimensional vapor chamber bonding structure

Publication Date: 2026.02.26 TAIWAN MICROLOOPS CORP

AI summary

A three-dimensional vapor chamber bonding structure includes a housing, heat pipes, a capillary member, and a working fluid. The housing includes a first shell plate and a second shell plate, creating a cavity between them. The second shell plate is equipped with through-holes, each through-hole surrounded by a recessed groove. The heat pipes, which each include an open end equipped with a flange, extend through the through-holes with the flanges received in the recessed grooves. The heat pipes are joined to the second shell plate through the flanges and weldments inside the recessed grooves. The capillary member is installed within the cavity and adhered to the housing. The working fluid is contained within the cavity. This configuration not only provides a stable and strong connection but also prevents low-melting-point solder from entering the cavity and impeding the flow of the working fluid.