3D-Shaped Vapor Chamber for Semiconductor Heat Dissipation
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Solution Overview
Problem
Conventional vapor chamber designs for semiconductor devices have limited surface area for cooling, leading to inefficiencies in heat transfer due to internal fins not being in direct contact with the ambient environment, requiring larger enclosures and lower cooling efficiency compared to external fins.
Innovation Solution
A fin-shaped vapor chamber with a wick-assisted three-dimensional structure that increases surface area for two-phase heat transfer, allowing vapor to reach interior and exterior sidewalls for enhanced cooling efficiency, compatible with various chip orientations and configurations, and can be combined with other cooling mechanisms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal fins are used inside the vapor chamber enclosure, then the vapor chamber can be made compact, but the cooling surface area is limited and heat transfer efficiency is reduced
Solution Approach 1:
The patent transitions from two-dimensional internal fin structures to three-dimensional external fin structures that extend outward from the vapor chamber. This dimensional change allows the cooling surface to expand in multiple directions (height, width, and depth) while maintaining a compact base vapor chamber volume. The external fins create a multi-layered cooling surface that is accessible to ambient air from all sides.
Solution Approach 2:
The cooling surface is segmented into multiple external fin structures that are distributed around the vapor chamber perimeter. Each fin acts as an independent cooling element with its own surface area, and the fins are arranged to maximize exposure to ambient air flows. This segmentation allows the total cooling surface area to be significantly increased without proportionally increasing the vapor chamber volume.
2Volume of moving object
If internal fins are used inside the vapor chamber, then the structure can be compact, but the fins are not in direct contact with ambient environment reducing cooling efficiency
Solution Approach 1:
The cooling fins are extracted from the internal enclosure space and repositioned to the external surface of the vapor chamber. This extraction allows the fins to directly contact the ambient environment and benefit from natural convection and forced air flows. The vapor chamber base remains compact while the cooling function is externalized to where it can most effectively interact with the surrounding air.
Solution Approach 2:
The external fins serve as an intermediary between the vapor chamber and the ambient air. They increase the heat transfer surface area and improve the thermal coupling between the vapor chamber and the cooling air flow. The fins act as a thermal bridge that enhances the overall heat dissipation efficiency without requiring the vapor chamber itself to be larger.
3Power
If conventional heat sinks are used to meet increasing heat flux density demands, then more cooling surface area can be provided, but the device size and weight increase
Solution Approach 1:
The patent employs aluminum as the base material for the vapor chamber and fins, which provides an optimal balance between thermal conductivity, density, and manufacturability. Aluminum offers high thermal conductivity (approximately 237 W/m·K) sufficient for high heat flux applications, while maintaining low density (approximately 2.7 g/cm³) to minimize weight. This material selection enables the heat sink to handle high power densities without the excessive weight that would result from using denser materials like copper.
Solution Approach 2:
By transitioning to external three-dimensional fins, the patent achieves dramatically increased cooling surface area from a compact base volume. The external fin structure allows heat dissipation surface area to scale independently of the vapor chamber volume, enabling high heat flux density handling capability while maintaining a lightweight, space-efficient design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D-shaped vapor chamber design significantly improves heat transfer efficiency by increasing surface area and allowing direct contact with external coolants, effectively handling high heat flux densities while maintaining a compact size comparable to conventional models.
Implementation Method 1
The condensed liquid is returned to the evaporator unit through the capillary action of the wick structure.
Implementation Method 2
heat generated in the evaporator unit vaporizes the liquid in the wick
Implementation Method 3
The vapor then carries the latent heat of vaporization and flows into the cooler condenser unit
Implementation Method 4
where it condenses and releases the heat
Implementation Method 5
Heat pipes and vapor chambers are other promising technologies based on the principle of two-phase heat exchange
Data Source
AI summary
An apparatus for providing two-phase heat transfer for semiconductor devices includes a vapor chamber configured to carry a cooling liquid, the vapor chamber having base section, and a plurality of three-dimensional (3D) shaped members. The plurality of 3D-shaped members have interior and exterior sidewalls, the 3D-shaped members being connected to the base section so that vapor carrying latent heat can reach the respective interior sidewalls and get transferred to the respective exterior sidewalls configured to be in contact with an external coolant. The vapor chamber is configured to be in contact with a semiconductor device in order to remove heat therefrom.