3D Via Stack Laminate for Fine-Pitch SoC Interconnects
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Solution Overview
Problem
Existing 3D integrated circuit technologies face challenges in achieving high functionality, block density, and smaller form factor with efficient interconnects, while also being cost-effective and reducing packaging cycle time.
Innovation Solution
The method involves forming layers of packaging laminate substrate material with precise vias to create a fine via stack laminate that allows for direct via-to-via connections between systems on chip, using a pitch of 40 to 80 micrometers, enabling face-to-face bonding with fine pitch interconnects and reducing reliance on redistribution layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional 3D IC technologies are used, then interconnect functionality is achieved, but device complexity and packaging cycle time increase
Solution Approach 1:
The patent transitions from conventional 2D packaging to 3D stacked architecture, where multiple substrate layers are vertically integrated with vias penetrating through layers to create direct interconnects. This dimensional change enables shorter signal paths and reduced packaging complexity despite increased vertical integration
Solution Approach 2:
The packaging structure is divided into multiple discrete substrate layers (first substrate layer, second substrate layer) that can be manufactured and processed separately, then integrated through via formation and bonding. This segmentation allows parallel processing and reduces overall packaging cycle time
2Adaptability or versatility
If fine pitch interconnects are implemented, then bandwidth and functionality are improved, but manufacturing precision requirements increase
Solution Approach 1:
Vias are formed in the substrate layers before final bonding and assembly. This preliminary via formation allows precise positioning and alignment to be established early in the manufacturing process, ensuring fine pitch accuracy is maintained through subsequent processing steps
Solution Approach 2:
The substrate layers act as intermediary structures that provide mechanical support and alignment references for the fine pitch via interconnects. These intermediaries enable precise via positioning while maintaining manufacturability through standard fabrication processes
3Length of moving object
If direct via-to-via connections are used, then signal escape length is reduced, but via formation complexity increases
Solution Approach 1:
Signal interconnects transition from lateral routing in 2D planes to vertical routing through stacked substrate layers. This dimensional change creates direct via-to-via connections that minimize signal escape length by eliminating unnecessary lateral signal paths
4Volume of moving object
If smaller form factor is achieved, then device density is improved, but manufacturing difficulty increases
Solution Approach 1:
The device is segmented into multiple thin substrate layers that can be manufactured using standard thin-film fabrication processes. These segmented layers are then stacked vertically, achieving compact form factor while maintaining ease of manufacture through modular processing
Solution Approach 2:
The device architecture transitions from horizontal expansion to vertical stacking, achieving smaller footprint by utilizing the z-dimension. Multiple functional layers are stacked with via interconnects, compacting the form factor without complicating manufacturing
Data Source
AI summary
A method for 3D integration may include forming a first layer of packaging laminate substrate material including a first plurality of vias formed therein. The method may additionally include forming a second layer of packaging laminate substrate material having a second plurality of vias formed therein. The method may also include stacking the first plurality of vias with the second plurality of vias. Various other methods, systems, and computer-readable media are also disclosed.