3D Wire Block Additive Manufacturing for Circuit Routing
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Solution Overview
Problem
Conventional interconnect technologies are limited by their two-dimensional routing capabilities, requiring dense internal circuitry layers and extensive use of through-vias, which increase design time and labor costs, especially when dealing with multiple contact points across circuit planes.
Innovation Solution
The use of additive manufacturing processes to create customizable electrical connections between circuit planes by first depositing metal and then filling with dielectric material, allowing for three-dimensional routing options and reducing the need for traditional via structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional 2D routing with through-vias is used, then electrical connections between circuit planes are established, but design time increases and routing options are limited
Solution Approach 1:
The patent transitions from conventional 2D planar routing to 3D spatial routing by forming conductive traces that extend through the thickness of the substrate. This dimensional change allows traces to connect contact pads on opposite surfaces directly through the substrate volume, bypassing the need for multiple routing layers and through-vias, thereby dramatically increasing routing flexibility and reducing design time
2Adaptability or versatility
If dense internal circuitry layers with multiple routing layers are used, then electrical coupling between multiple contact points is achieved, but manufacturing complexity increases
Solution Approach 1:
The invention eliminates the need for multiple stacked routing layers by utilizing the third dimension (substrate thickness) for trace routing. Traces are formed that extend through the substrate to connect contact pads on opposite surfaces, replacing the complex multilayer structure with a simpler single-substrate approach that maintains electrical coupling capability while reducing manufacturing complexity
Solution Approach 2:
The patent extracts and eliminates the intermediate routing layers and through-vias from the conventional multilayer structure. By forming direct traces through the substrate, the invention removes unnecessary intermediate structures, simplifying the overall manufacturing process while maintaining the ability to electrically couple multiple contact points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces design time and increases routing options by enabling flexible, three-dimensional electrical coupling of devices with improved mechanical strength and reduced construction steps, while maintaining efficient electrical connectivity.
Implementation Method 1
utilizing additive manufacturing processes electrical connections are created
Implementation Method 2
filling with dielectric material
Data Source
AI summary
The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.