3D Wire Layout in Electromagnetic Wave Sensors for Low Parasitic Capacitance
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Solution Overview
Problem
Conventional electromagnetic wave sensors experience reduced operating speed and detection accuracy due to parasitic capacitance at intersections of wires in the thermistor elements.
Innovation Solution
The electromagnetic wave sensor is designed with first and second wires positioned at different orthogonal directions, intersecting three-dimensionally, and supported by pillars to minimize parasitic capacitance, enhancing mechanical strength and absorption efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If first wire and second wire are arranged at different positions in thickness direction to three-dimensionally intersect, then electrical connection is achieved, but parasitic capacitance increases lowering operating speed and detection accuracy
Solution Approach 1:
The patent transitions from planar wire arrangement to three-dimensional arrangement by positioning the first wire and second wire at different heights in the thickness direction. This spatial separation in the third dimension reduces parasitic capacitance between the wires while maintaining their necessary electrical connections to the thermistor element, thereby improving operating speed and detection accuracy.
2Reliability
If first wire and second wire are arranged at different positions in thickness direction to three-dimensionally intersect, then electrical connection is achieved, but parasitic capacitance increases lowering detection accuracy
Solution Approach 1:
The patent transitions from planar wire arrangement to three-dimensional arrangement by positioning the first wire and second wire at different heights in the thickness direction. This spatial separation in the third dimension reduces parasitic capacitance between the wires while maintaining their necessary electrical connections to the thermistor element, thereby improving operating speed and detection accuracy.
3Volume of moving object
If wires are positioned close to each other for compact design, then device size is reduced, but parasitic capacitance increases
Solution Approach 1:
The patent utilizes the thickness direction (third dimension) to separate the first wire and second wire vertically while keeping their planar projections close together. This approach maintains compact device footprint in the plane while reducing parasitic capacitance through vertical separation, effectively resolving the contradiction between compact size and low parasitic capacitance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high operating speed and detection accuracy by reducing parasitic capacitance and improving electromagnetic wave absorption, enabling two-dimensional temperature distribution imaging.
Implementation Method 1
infrared rays (electromagnetic waves) incident on the thermistor film are absorbed by the thermistor film or materials around the thermistor film
Implementation Method 2
The electrical resistance of a thermistor film of the thermistor element changes according to the temperature change of the thermistor film
Implementation Method 3
according to the Stefan-Boltzmann law, there is a correlation between the temperature of a measurement target and infrared rays (radiant heat) emitted from the measurement target by heat radiation
Data Source
AI summary
The electromagnetic wave sensor includes: a first substrate; a first wire which extends in a first direction parallel to a substrate surface of the first substrate in a plan view from a direction perpendicular to the substrate surface; a second wire which extends in a direction parallel to the substrate surface and different from the first direction in the plan view; and an electromagnetic wave detector which is electrically connected to the first wire and is electrically connected to the second wire, wherein the first wire is located on the first substrate side in relation to the electromagnetic wave detector in a third direction orthogonal to the first direction and the second direction and the second wire is located on a side opposite to the first substrate in relation to the electromagnetic wave detector in the third direction.