3D Wood Grain Board Printing With Precise Texture Alignment

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for creating three-dimensional wood grain on artificial boards struggle with accurately aligning the three-dimensional wood grain to the underlying printed image, leading to misalignment and increased production costs due to inflexible manufacturing processes.

Innovation Solution

A method involving the creation of a wood grain information database that includes both underlying wood grain and three-dimensional wood grain datasets, allowing for precise alignment and customization by using two printing devices to output the wood grain precursor and precursor liquid, followed by curing to form a three-dimensional wood grain layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional embossing methods are used to create three-dimensional wood grain, then the manufacturing process is simple, but the alignment accuracy between the three-dimensional wood grain and the underlying printed image is poor

Engineering Contradiction:
Improvealignment accuracyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manufacturing process is divided into distinct stages: first printing the underlying image, then applying precursor liquid, and finally curing to form the three-dimensional wood grain. This segmentation allows each stage to be optimized independently, ensuring precise alignment between the printed image and the resulting three-dimensional structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The underlying wood grain image is printed on the substrate before the three-dimensional wood grain is formed. This preliminary action establishes a reference pattern that guides the subsequent formation of the three-dimensional structure, ensuring accurate alignment between the two-dimensional image and the three-dimensional relief.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If traditional embossing methods are used, then the manufacturing process is straightforward, but the production cost increases due to inflexible manufacturing processes

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidproduction cost
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The manufacturing process uses liquid precursor materials that can be dynamically applied and shaped according to the printed image pattern. This dynamic approach allows for flexible customization of different wood grain patterns without requiring expensive retooling, thereby reducing production costs while maintaining ease of manufacture.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The process utilizes changes in the physical state of the precursor liquid during curing to form the three-dimensional structure. By controlling parameters such as UV exposure time and intensity, the manufacturing process can be easily adjusted for different production volumes and patterns, improving flexibility while controlling costs.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If embossing methods are used to form three-dimensional structures, then the process is simple, but the alignment between the three-dimensional wood grain and the printed image is inaccurate

Engineering Contradiction:
Improvealignment accuracyVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The process creates a precise copy of the printed two-dimensional wood grain image in three-dimensional form. The precursor liquid is applied to exactly replicate the printed pattern, and upon curing, produces a three-dimensional relief that accurately copies the underlying image, achieving high alignment accuracy without compromising production efficiency.

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The traditional mechanical embossing process is replaced with a photochemical curing process. Instead of using physical pressure and molds to create the three-dimensional structure, UV light is used to cure the precursor liquid in the desired pattern, achieving superior alignment accuracy while maintaining high production efficiency through a non-contact process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves high alignment accuracy between the three-dimensional wood grain and the underlying image, reducing production costs and enabling customized production with improved efficiency and product diversity.

Implementation Method 1

irradiating with a UV lamp to cure the wood grain precursor, thereby forming a three-dimensional wood grain layer

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentEP4699785A1Method for manufacturing plate having three-dimensional wood grain on surface
Publication Date: 2026.02.25 HANGZHOU PRINT FLOORING TECHNOLOGY CO LTD
  • EP4699785A1 patent drawingFigure 1~2
  • EP4699785A1 patent drawingFigure 3~4
  • EP4699785A1 patent drawingFigure 5~6

AI summary

The present invention relates to the field of surface structure preparation, particularly to a method for manufacturing a board having a three-dimensional wood grain on the surface thereof, which comprises at least the following steps: obtaining a wood grain pattern and processing it to extract a wood surface database, the database including at least an underlying wood grain printing dataset and a three-dimensional wood grain printing dataset. The first printing device outputs on the surface of the board using the underlying wood grain printing dataset to obtain an underlying wood grain layer matching the wood grain pattern, and the second printing device outputs wood grain precursor liquid above the underlying wood grain layer using the three-dimensional wood grain printing dataset to obtain a wood grain precursor matching the wood grain texture. The present application, through the corresponding matching relationship between the underlying wood grain printing dataset and the three-dimensional wood grain printing dataset, can obtain a three-dimensional wood grain layer completely corresponding to the underlying wood grain layer on the surface of the board, thereby effectively improving the alignment accuracy between the two.