Individually Controllable Cooling Modules for 3DIC Thermal Management
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Solution Overview
Problem
Conventional cooling techniques are inadequate for effectively managing the thermal challenges posed by three-dimensional integrated circuits (3DICs) due to their dense integration and small cooling surface area, leading to inefficient heat dissipation.
Innovation Solution
A structure and method involving individually controllable cooling modules with a cold pole and heat sink, coupled via N-type and P-type semiconductor elements, which absorb and dissipate heat, and are controlled by thermal monitoring elements to target specific heat spots within the 3DIC.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cooling techniques are used for 3DICs, then the cooling structure is simple, but heat dissipation efficiency is insufficient due to dense integration and small cooling surface area
Solution Approach 1:
The cooling element is divided into multiple individually controllable cooling modules, each capable of independent operation. This segmentation allows targeted cooling of specific hot spots within the 3DIC, maximizing the effective use of the limited cooling surface area while maintaining high heat dissipation efficiency.
Solution Approach 2:
Different regions of the cooling element are designed with locally optimized properties through individual module control. Each cooling module can be independently activated or deactivated based on the thermal conditions at its corresponding location, enabling precise local heat dissipation where most needed.
2Productivity
If multiple cooling modules are used to target specific heat spots, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The system controls cooling module operation by changing the parameter of individual module activation states (on/off). This simple binary control mechanism manages the complexity of multiple cooling modules through straightforward parameter adjustment based on temperature sensor feedback, maintaining ease of control while achieving efficient targeted cooling.
3Reliability
If cooling modules are continuously operated to maintain low temperatures, then temperature control is reliable, but power consumption increases
Solution Approach 1:
Instead of continuous operation, cooling modules are activated periodically or intermittently based on real-time temperature measurements from sensors. This periodic activation maintains reliable temperature control by engaging cooling only when and where needed, significantly reducing overall power consumption while preserving temperature management effectiveness.
Solution Approach 2:
Temperature sensors provide continuous feedback to the control system, which then adjusts cooling module operation accordingly. This feedback mechanism ensures reliable temperature control by responding to actual thermal conditions, while avoiding unnecessary cooling operation that would waste energy, thus achieving the balance between reliability and power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and efficient cooling of 3DICs by dynamically turning on and off cooling modules based on temperature measurements, optimizing heat dissipation and reducing power consumption.
Implementation Method 1
The heat sink is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element
Implementation Method 2
The cold pole is configured to absorb heat from the 3DIC
Implementation Method 3
The heat sink is configured to dissipate the heat absorbed by the cold pole
Implementation Method 4
The heat sink is configured to dissipate the heat absorbed by the cold pole
Data Source
AI summary
A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.