3DIC Heat Dissipation Ring and Lid for Inner Die Cooling
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Solution Overview
Problem
Three-Dimensional Integrated Circuits (3DICs) face challenges in efficiently dissipating heat generated in inner dies due to ineffective heat conduction through materials like underfill and molding compound, which hinders the dissipation of heat to outer components.
Innovation Solution
The implementation of a heat dissipation structure comprising a heat dissipation ring and lid with high thermal conductivity, positioned to directly dissipate heat from high-power-consuming circuits without traversing lower-power dies, using materials such as metals and metal alloys, and a thermal interface material with enhanced thermal conductivity to facilitate direct heat transfer to heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked dies are bonded through bonding to form 3DICs, then integration density is improved, but heat dissipation efficiency deteriorates due to bottlenecks in dissipating heat from inner dies
Solution Approach 1:
The patent segments the heat dissipation function by introducing separate heat dissipation paths for different dies. Heat dissipation rings are selectively applied to specific dies (e.g., inner dies or high-power dies) rather than using a uniform approach, allowing targeted heat management for each die stack while maintaining the 3DIC structure.
Solution Approach 2:
The patent introduces heat dissipation rings as intermediary structures between the dies and the external environment. These rings act as thermal mediators that facilitate heat transfer from inner dies through the stacking interface to outer dies or directly to heat sinks, bypassing the thermal resistance of underfill and molding materials.
2Strength
If materials such as underfill and molding compound are used between stacked dies, then structural integrity is improved, but heat conduction capability deteriorates
Solution Approach 1:
The patent segments the bonding interface by introducing heat dissipation rings at specific locations between dies. These rings create localized high-conductivity pathways that are distinct from the underfill and molding compound regions, separating the structural support function (handled by underfill/molding) from the heat conduction function (handled by heat dissipation rings).
Solution Approach 2:
The patent employs composite heat dissipation structures combining different materials with complementary properties. Heat dissipation rings are made from materials with high thermal conductivity (such as metal alloys or diamond-like carbon) and are integrated with the die stacking structure, creating a composite system that simultaneously provides structural integrity and superior heat conduction.
3Reliability
If stacked dies are molded in molding compound, then protection and structural stability are improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent segments the molding compound structure by introducing heat dissipation rings that extend through or beyond the molding compound. These rings create dedicated heat conduction channels that are independent of the molding compound, allowing the molding to provide protection and stability while the rings handle heat dissipation.
Solution Approach 2:
The heat dissipation rings serve as intermediary structures that bridge the gap between the molded die stack and external heat sinks. They provide a direct thermal pathway that bypasses the molding compound's thermal resistance, enabling efficient heat removal while the molding compound continues to provide mechanical protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces operation temperatures of both high and low-power circuits within the 3DIC packages, eliminating hot spots and improving overall heat dissipation efficiency by providing dedicated heat paths for each die, thereby enhancing the reliability and performance of the packages.
Implementation Method 1
A thermal interface material is over and contacting a top surface of the second die. A heat dissipating ring is over and contacting the thermal interface material
Implementation Method 2
The implementation of a heat dissipation structure comprising a heat dissipation ring and lid with high thermal conductivity, positioned to directly dissipate heat from high-power-consuming circuits
Implementation Method 3
using materials such as metals and metal alloys, and a thermal interface material with enhanced thermal conductivity to facilitate direct heat transfer to heat sinks
Data Source
AI summary
A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending laterally beyond a respective edge of the first die. The package further includes a first Thermal Interface Material (TIM) over and contacting a top surface of the first die, a heat dissipating lid having a first bottom surface contacting the first TIM, a second TIM over and contacting the second portion of the second die, and a heat dissipating ring having a portion over and contacting the second TIM. The heat dissipating lid and the heat dissipating ring are discrete components, and at least one of the heat dissipating lid or the heat dissipating ring has a plurality of fins and a plurality of recesses separating the plurality of fins from each other.