3DIC Package Thermal Path for Inner-Die Hot Spot Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Three-Dimensional Integrated Circuits (3DICs) face challenges in heat dissipation due to non-conductive materials between stacked dies, leading to localized temperature peaks (hot spots) that affect electrical performance and reliability.
Innovation Solution
The implementation of a package with efficient hot spot thermal management features, including a substrate with conductive layers and high thermal conductivity materials, along with a contour ring and lid for effective heat dissipation, to conduct heat away from the die stack to peripheral areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked dies are bonded through bonding to form 3DICs, then integration density is improved, but heat dissipation capability deteriorates due to non-conductive materials trapping heat in inner regions
Solution Approach 1:
A thermal management die is introduced as an intermediary component between the stacked dies and the heat spreader. This intermediate layer contains thermal management devices that actively pump heat from inner die regions through conductive paths to peripheral areas, overcoming the heat trapping effect of non-conductive materials while preserving the stacked die configuration
Solution Approach 2:
The thermal management die incorporates localized thermal management devices positioned specifically over inner die regions where heat traps form. These devices create localized heat pumping paths that address the specific thermal problem in inner regions without affecting the overall stacked die structure or requiring changes to the non-conductive bonding materials
2Reliability
If non-conductive materials such as underfill and molding compound are used between stacked dies, then electrical isolation is improved, but thermal conduction capability deteriorates causing hot spots
Solution Approach 1:
The thermal management die segments the heat flow path by creating separate conductive channels through its structure. Thermal management devices are positioned to intercept heat from specific inner die regions and channel it through dedicated conductive paths to peripheral heat spreader areas, bypassing the non-conductive materials that would otherwise trap the heat
Solution Approach 2:
The thermal management die acts as a mediator layer that bridges the electrical isolation provided by non-conductive materials and the thermal conduction needed to prevent hot spots. It contains embedded conductive elements that create thermal pathways without compromising the electrical isolation function of the underfill and molding compound
3Device complexity
If heat is trapped in inner regions of bottom stacked die, then device integration is simplified, but hot spot formation increases affecting electrical performance and reliability
Solution Approach 1:
The thermal management devices are positioned in advance over inner die regions before heat generation occurs during operation. This preliminary positioning of thermal management elements allows proactive heat interception and redirection through conductive paths, preventing hot spot formation before it affects electrical performance
Solution Approach 2:
A thermal management die is introduced as an intermediate layer between the bottom stacked die and the heat spreader. This intermediate structure contains thermal management devices that actively manage heat flow from inner regions, preventing hot spot formation without requiring changes to the underlying die integration structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces operation temperatures and minimizes the impact of hot spots on overlaying devices, enhancing the thermal management and reliability of 3DICs by efficiently dissipating heat to peripheral regions.
Implementation Method 1
high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer
Data Source
AI summary
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.