3DIC Package Structure for Die-Antenna Alignment and Interconnects
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Solution Overview
Problem
Existing semiconductor device packaging technologies face challenges in efficiently integrating semiconductor dies and antenna elements while ensuring stable electrical connections and signal transmission, particularly in three-dimensional integrated circuit (3DIC) structures.
Innovation Solution
A manufacturing method involving a carrier with a debond layer, redistribution circuit structures, conductive pillars, and antenna elements, followed by encapsulation and planarization, allows for the formation of stable electrical connections between semiconductor dies and antennas, enabling efficient integration in 3DIC packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer level packaging is used to integrate semiconductor dies and antenna elements, then manufacturing efficiency is improved, but achieving stable electrical connections and proper alignment becomes more difficult
Solution Approach 1:
The patent applies preliminary action by forming alignment marks and reference structures on the carrier substrate before depositing the redistribution circuit structures and antenna elements. This pre-established reference framework enables precise alignment during subsequent manufacturing steps, resolving the contradiction between manufacturing efficiency and alignment precision in wafer level packaging
Solution Approach 2:
The patent introduces an intermediary alignment mark structure that mediates between the carrier substrate and the semiconductor dies/antenna elements. These alignment marks serve as a reference interface that enables precise positioning and electrical connection, allowing wafer level processing to achieve both high productivity and manufacturing precision
2Adaptability or versatility
If three-dimensional integrated circuit structures are implemented, then device functionality is enhanced, but ensuring stable electrical connections becomes more challenging
Solution Approach 1:
The patent implements another dimension by transitioning from planar two-dimensional packaging to three-dimensional vertical stacking with redistribution circuit structures at multiple levels. The conductive pillars and redistribution layers create vertical electrical connections, enabling enhanced device functionality while maintaining connection stability through controlled vertical integration rather than lateral expansion
3Reliability
If conductive pillars and redistribution circuit structures are formed, then electrical connection stability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies merging by combining the formation of conductive pillars, redistribution circuit structures, and antenna elements into an integrated manufacturing process sequence. Multiple functions are achieved in a unified process flow on the wafer level, reducing overall manufacturing process complexity while maintaining electrical connection stability through the combined structure
Data Source
AI summary
A package includes a semiconductor package including a semiconductor die and a first insulating encapsulation, a substrate, and a second insulating encapsulation. The first insulating encapsulation encapsulates the semiconductor die. The substrate includes a redistribution circuitry, wherein the substrate is electrically coupled to the semiconductor package through the redistribution circuitry. The second insulating encapsulation is disposed on and partially covers the substrate, wherein the substrate is sandwiched between the semiconductor package and the second insulating encapsulation.