3DIC Package Thermal Dissipation Structure for Stacked Die Heat Paths
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Solution Overview
Problem
Heat dissipation is a challenge in Three-Dimensional Integrated Circuits (3DICs) due to inefficiencies in dissipating heat generated within stacked semiconductor dies.
Innovation Solution
A thermal dissipation structure is integrated into the package structure, utilizing a thermal transmission path composed of dielectric layers and conductive planes, along with capacitors and bonding vias to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor dies are stacked through bonding to form 3DICs, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a thermal dissipation structure that extends in the vertical dimension (Z-axis) through the stacked die configuration. Thermal vias and heat dissipation paths are formed through multiple layers and die stacks, utilizing the third dimension to create efficient heat conduction pathways from inner dies to outer surfaces, thereby resolving the heat dissipation bottleneck in 3DIC architectures.
Solution Approach 2:
The patent employs thermal dissipation structures including thermal vias, heat spreaders, and thermally conductive materials as intermediary elements between the heat-generating inner dies and the external environment. These intermediary structures facilitate heat transfer from the embedded heat sources through the package layers to external heat sinks, addressing the thermal management challenge.
2Temperature
If thermal dissipation structures are added to manage heat, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The thermal dissipation structures are designed to perform multiple functions: thermal vias serve both as electrical interconnects and thermal conduction paths; the heat spreader layer simultaneously dissipates heat and provides structural support; encapsulant materials provide both thermal management and mechanical protection. This multi-functionality reduces the need for separate dedicated thermal management components.
Solution Approach 2:
The patent merges thermal management functions with existing package structures. The heat spreader is integrated into the package substrate, thermal vias are formed through existing interconnect layers, and the encapsulant serves dual purposes of protection and thermal conduction. This integration approach incorporates thermal management without adding separate complex subsystems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated thermal dissipation structure effectively manages heat dissipation in 3DICs, improving the thermal performance and reliability of the package structure.
Implementation Method 1
a thermal transmission path composed of dielectric layers and conductive planes
Data Source
AI summary
A package structure includes a first thermal dissipation structure. The first thermal dissipation structure includes a semiconductor substrate, conductive vias, a thermal transmission structure, first capacitors, bonding pads, and bonding vias. The conductive vias are embedded in the semiconductor substrate. The thermal transmission structure is disposed over the semiconductor substrate and the conductive vias. The thermal transmission structure includes a conductive plane. The first capacitors are at least partially embedded in the thermal transmission structure. The bonding pads and the bonding vias are embedded in the thermal transmission structure. The bonding vias electrically connect the conductive vias and the bonding pads. The conductive plane is in physical contact with sidewalls of at least one of the bonding pads.