3DIC Package Structure With Electro-Optical Signal Layer Overlap

An interposer is introduced as an intermediary substrate between stacked semiconductor dies, providing a platform for redistribution layers and interconnect structures. This interposer simplifies the complex interconnect architecture by centralizing the routing function, thereby reducing overall device complexity while maintaining high integration density through vertical stacking.

The patent transitions from planar 2D interconnect routing to 3D vertical stacking with multiple routing layers. By utilizing the vertical dimension and creating multiple conductive layers within the interposer, the design achieves higher integration density without proportionally increasing interconnect complexity, as the third dimension provides additional routing pathways.

The packaging structure is segmented into distinct functional modules: semiconductor dies, an interposer with redistribution layers, and encapsulation layers. This modular segmentation allows each component to be optimized and manufactured independently using conventional processes, while the assembled structure provides enhanced design flexibility for various die configurations and interconnect schemes.

The interposer serves multiple functions simultaneously: it provides mechanical support for stacked dies, enables electrical interconnection through redistribution layers, facilitates thermal management pathways, and allows for diverse die arrangements. This multi-functionality achieves design flexibility without requiring entirely new manufacturing processes, maintaining compatibility with existing semiconductor fabrication capabilities.