3DIC Ring Structure Layout for Warpage Control and Device Reliability
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Solution Overview
Problem
The semiconductor industry faces challenges in controlling warpage of 3DIC semiconductor structures, which can lead to reduced yield and reliability of semiconductor devices, especially when conventional ring structures contact underlying components during package warpage.
Innovation Solution
A ring structure with an overhang portion and opening patterns is disposed on a circuit substrate to encircle semiconductor devices, allowing for effective control of warpage without contacting the underlying devices, thus enhancing yield and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a conventional ring structure is used to control warpage, then warpage control is improved, but the ring structure contacts underlying semiconductor devices causing reliability degradation
Solution Approach 1:
The ring structure is segmented by introducing opening patterns that divide the continuous ring into separated sections. This segmentation allows the ring structure to control warpage through its overall circular geometry while the openings prevent contact with underlying semiconductor devices, thus maintaining both warpage control capability and device reliability.
Solution Approach 2:
Material is extracted from the ring structure by creating opening patterns, removing the portions that would otherwise contact the underlying semiconductor devices. This extraction maintains the warpage control function through the remaining ring structure while eliminating the harmful contact that would degrade device reliability.
2Productivity
If integration density is increased by reducing minimum feature size, then productivity is improved, but manufacturing complexity increases
Solution Approach 1:
The ring structure with opening patterns serves multiple functions simultaneously: it controls warpage of the 3DIC semiconductor structure, prevents contact with underlying devices, and can be integrated with existing packaging processes. This multi-functionality allows integration density improvement without proportionally increasing manufacturing complexity.
Data Source
AI summary
A semiconductor structure includes a circuit substrate, at least one semiconductor package, at least one semiconductor device, and a ring structure. The at least one semiconductor package is disposed on the circuit substrate, and the semiconductor package includes a plurality of integrated circuit structures. The at least one semiconductor device, disposed on the circuit substrate and aside the semiconductor package. The ring structure is disposed on the circuit board. The ring structure includes at least one opening pattern corresponding to the semiconductor device.