3DIC Seal Ring Structure for Bonding Interface Contamination Protection
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Solution Overview
Problem
The challenge in semiconductor manufacturing lies in protecting the bonding interface of stacked semiconductor devices from water, chemicals, and contaminants during processing, which can degrade device performance and yield.
Innovation Solution
A seal ring structure is integrated into the bonding interface of stacked semiconductor devices, formed simultaneously with conductive features, to prevent penetration of contaminants and enhance device integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding interface is left exposed during processing, then manufacturing simplicity is maintained, but contamination from water, chemicals, and contaminants degrades device performance and yield
Solution Approach 1:
The seal ring structure is merged with the bonding interface protection function, combining the sealing function with the structural support function. The seal ring is formed as an integrated structure that simultaneously provides mechanical support and contamination protection at the bonding interface, eliminating the need for separate protection layers.
Solution Approach 2:
The seal ring structure serves multiple functions: it provides mechanical support for the bonding interface, creates a barrier against water and chemicals, and maintains structural integrity during processing. This multi-functional design protects the bonding interface without requiring additional specialized components.
2Object-affected harmful factors
If a seal ring structure is added to protect the bonding interface, then contamination prevention is improved, but additional processing steps are required
Solution Approach 1:
The seal ring structure is formed in advance during the wafer fabrication process, before bonding occurs. This preliminary formation ensures the sealing function is already in place to protect the bonding interface from contamination during subsequent processing steps, eliminating the need for post-bonding protection measures.
Solution Approach 2:
The seal ring structure is formed using the existing wafer processing infrastructure and materials, leveraging the current manufacturing capabilities without requiring specialized equipment or processes. The structure serves itself by providing protection through its inherent design rather than requiring additional active protection mechanisms.
3Productivity
If the seal ring structure is formed separately from conductive features, then manufacturing flexibility is maintained, but additional processing steps and time are required
Solution Approach 1:
The seal ring structure and conductive features are merged into a single integrated formation process. Both structures are created simultaneously using the same processing steps, materials, and equipment, eliminating the need for separate formation operations and reducing overall manufacturing cycle time.
Solution Approach 2:
The formation process for the seal ring structure and conductive features is continuous, with both structures being created in the same processing sequence without interruption. This continuous action maximizes manufacturing efficiency by utilizing the same process flow for multiple structural elements.
Data Source
AI summary
A semiconductor device includes a first semiconductor chip including a first substrate, a plurality of first dielectric layers and a plurality of conductive lines formed in the first dielectric layers over the first substrate. The semiconductor device further includes a second semiconductor chip having a surface bonded to a first surface of the first semiconductor chip, the second semiconductor chip including a second substrate, a plurality of second dielectric layers and a plurality of second conductive lines formed in the second dielectric layers over the second substrate. The semiconductor device further includes a first conductive feature extending from the first semiconductor chip to one of the plurality of second conductive lines, and a first seal ring structure extending from the first semiconductor chip to the second semiconductor chip.