3DIC Thermal Structure Using Through-Substrate Vias and Heat Pipes
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Solution Overview
Problem
Three-dimensional integrated circuits (3DICs) face significant heat dissipation challenges, particularly with the bottom die experiencing high thermal resistance, leading to excessive junction temperatures and reduced reliability due to inadequate heat dissipation methods.
Innovation Solution
The implementation of a package structure with heat pipes that induce substrate-side cooling by using through-substrate vias and heat pipes to facilitate thermal conduction from the bottom die to the substrate, enhancing heat dissipation through the substrate and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mounted on the top die for cooling, then the top die experiences good heat dissipation through natural convection, but the bottom die suffers from heat dissipation problems due to high thermal resistance of the top die
Solution Approach 1:
The patent divides the heat dissipation function into two independent cooling paths: one for the top die (heat sink on top surface) and one for the bottom die (heat sink on bottom surface). This segmentation allows each die to have dedicated cooling, eliminating the thermal resistance bottleneck that previously affected the bottom die while maintaining effective cooling for the top die.
2Productivity
If more devices are stacked in 3DIC configuration, then integration density and footprint are improved, but heat dissipation becomes more difficult due to increased thermal resistance
Solution Approach 1:
The patent transitions from single-sided (one-dimensional) heat dissipation to dual-sided (two-dimensional) heat dissipation by placing heat sinks on both the top and bottom surfaces of the substrate. This dimensional change enables heat to be extracted from both sides of the stacked die configuration, effectively managing thermal loads in high-density 3DIC packages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat buildup in 3DICs, improving thermal performance and extending the operating lifetime of dies by providing additional and efficient heat dissipation pathways, especially for high-power components like CPUs.
Implementation Method 1
using through-substrate vias and heat pipes to facilitate thermal conduction from the bottom die to the substrate
Implementation Method 2
package structure with heat pipes that induce substrate-side cooling
Data Source
AI summary
One or more heat pipes are utilized along with a substrate in order to provide heat dissipation through the substrate for heat that can build up at an interface between the substrate and one or more semiconductor chips in a package. In an embodiment the heat pipe may be positioned on a side of the substrate opposite the semiconductor chip and through-substrate vias may be utilized to dissipate heat through the substrate. In an alternative embodiment, the heat pipe may be positioned on a same side of the substrate as the semiconductor chip and may be thermally connected to the one or more semiconductor chips.