3D Integrated Circuit Wireless Power Device for ESD-Free Testing
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Solution Overview
Problem
Conventional methods for accessing information in three-dimensional integrated circuits (3DICs) require extra power and sophisticated equipment, leading to inconvenient setups and risks of electrostatic discharge (ESD) damage, while also incurring area penalties due to increased layout requirements for connections, and existing methods are unreliable if connections fail.
Innovation Solution
Incorporating a wireless power device (WPD) into the 3DIC for wirelessly receiving power to enable functions such as probing, testing, and accessing information without the need for physical connections, using a wireless power transfer device (WPTD) to facilitate wireless information access and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional probing equipment and physical connections are used to access information in 3DIC, then information can be accessed, but it requires extra power supply and sophisticated installation equipment, causing inconvenient setups
Solution Approach 1:
The patent replaces mechanical probing systems with wireless communication systems. Instead of using physical probes and cables to access chip information, the invention embeds wireless transceivers (WiFi, Bluetooth, NFC) that enable information access through electromagnetic waves, eliminating the need for complex physical testing equipment and power connections
Solution Approach 2:
The patent introduces wireless communication modules as intermediaries between the chip and external devices. These modules act as mediators that transmit information wirelessly, replacing direct physical connections and eliminating the need for sophisticated probing equipment and manual setup
2Loss of information
If manual touch or machine contact is used to access information, then information can be retrieved, but electrostatic discharge (ESD) damage occurs to the chip
Solution Approach 1:
The patent replaces mechanical contact-based information retrieval with wireless communication. By using embedded transceivers to transmit data through electromagnetic fields, the system eliminates physical contact entirely, thereby removing the source of electrostatic discharge that causes ESD damage to sensitive chip components
3Loss of information
If C4/TSV connections are used for information tracking, then information can be transmitted, but area penalty increases due to extra layout requirements
Solution Approach 1:
The patent makes the wireless communication module multi-functional, serving both as a data transmission device and as an information access interface. This eliminates the need for separate C4/TSV connection structures, as the wireless module handles all information transmission needs, thereby reducing the area penalty associated with traditional interconnect structures
4Loss of information
If C4/TSV connections are used for information tracking, then information can be transmitted, but reliability decreases once one connection fails
Solution Approach 1:
The patent segments the information transmission function into multiple independent wireless communication channels (WiFi, Bluetooth, NFC). This segmentation provides redundancy, as information can be transmitted through alternative channels if one fails, thereby significantly improving the reliability of information access compared to single-point C4/TSV connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution eliminates the need for physical equipment and reduces the risk of ESD damage, while also avoiding area penalties by allowing wireless access and testing, ensuring reliable and efficient information retrieval and recording across stacked chips.
Implementation Method 1
a wireless power device (WPD) for wirelessly receiving a power
Data Source
AI summary
A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure.


