5G Antenna Module PCB Structure for Shared Ground Integration
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Solution Overview
Problem
The challenge is to accommodate a 5G antenna module and legacy antennas in a limited internal space of electronic devices, as the size of the 5G antenna module increases with more antenna elements to improve performance, and existing solutions do not efficiently utilize the available space.
Innovation Solution
The electronic device incorporates a first printed circuit board (PCB) with a non-conductive and conductive region, where the 5G antenna module includes a second PCB with an antenna array and a conductive layer acting as a ground, allowing the first wireless communication circuit to operate in a lower frequency band and the second wireless communication circuit to operate in a higher frequency band, sharing the conductive layer for efficient space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the 5G antenna module includes more antenna elements to improve performance, then the performance of the 5G antenna is improved, but the size of the 5G antenna module increases
Solution Approach 1:
The patent merges the 5G antenna module with the legacy antenna module by making the second PCB (containing the 5G antenna array) also serve as the mounting substrate for the legacy antenna. The conductive layer on the second PCB functions as both the ground for the 5G antenna elements and the radiator for the legacy antenna, thereby combining two separate antenna systems into one integrated module that reduces overall size while maintaining both 5G and legacy communication capabilities
Solution Approach 2:
The second PCB is designed with multi-functionality: it serves as the substrate for the 5G antenna array, provides a ground plane for the 5G elements, and simultaneously acts as the radiator for the legacy antenna. The conductive layer on this PCB performs dual roles - as ground for 5G and as radiating element for legacy frequencies, allowing one component to fulfill multiple functions that would traditionally require separate components
2Reliability
If the 5G antenna module and legacy antenna are mounted separately, then each antenna can operate independently, but the space inside the electronic device becomes insufficient
Solution Approach 1:
The patent combines the mounting functions by making the second PCB serve as both the 5G antenna substrate and the legacy antenna mounting platform. The legacy antenna is mounted on the second PCB and uses its conductive layer as radiator, while the 5G antenna elements are arranged on the same PCB. This merging approach allows both antenna systems to coexist in a compact integrated module rather than requiring separate mounting spaces
Solution Approach 2:
The legacy antenna is nested within the same PCB structure that houses the 5G antenna array. The legacy antenna and its feed network are integrated into the second PCB, utilizing the same physical substrate and ground plane, effectively nesting one antenna system within the structural framework of the other to maximize space efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the effective operation of legacy antennas within the 5G antenna module, reducing the mounting space required for both modules and maintaining performance levels, allowing for a more compact and efficient electronic device design.
Implementation Method 1
a conductive layer (220) operating as a ground of the antenna array... configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer
Data Source
AI summary
An electronic device may include a first PCB including a non-conductive region and a conductive region operating as a ground, a first wireless communication circuit disposed on the first PCB, and a 5th generation (5G) antenna module disposed adjacent to the first PCB. The 5G antenna module may include at least one second PCB including an antenna array and a conductive layer operating as a ground of the antenna array and a second wireless communication circuit electrically connected to the antenna array. The second PCB may include a first portion and a second portion having a predetermined angle with the first portion. The first portion may be disposed adjacent to the non-conductive region and at least part of the second portion may be disposed adjacent to the conductive region. The first wireless communication circuit may be electrically connected to a first point of the conductive layer included in the first portion and transmitting or receiving a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer. The second wireless communication circuit may transmit or receive a second RF signal in a second frequency band by using the antenna array. Besides, various embodiments as understood from the specification are also possible.