Separable 5G Antenna Module With Plated PCB Coupling Structure
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Solution Overview
Problem
Existing 5G communication systems face challenges in efficiently designing antenna structures due to space constraints and the need for high-performance antennas with multiple components, leading to difficulties in mass production and reliable coupling connections.
Innovation Solution
A separable antenna structure is implemented using a flexible printed circuit board (FPCB) with a coupling structure between PCBs, facilitated by an adhesive material, allowing for robust and efficient assembly of antennas and RF components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separable antenna structure is implemented using FPCB with coupling structures between PCBs, then mass production reliability and assembly robustness are improved, but manufacturing complexity and production difficulty increase
Solution Approach 1:
The antenna system is divided into separate PCB modules with standardized coupling structures. Each PCB can be manufactured independently with precise coupling pads and alignment features, then assembled together. This segmentation improves reliability by allowing specialized manufacturing processes for each module while maintaining standardized interfaces for robust assembly.
Solution Approach 2:
Adhesive materials serve as intermediaries between the coupling structures on different PCBs. The adhesive layers with controlled thickness and properties facilitate reliable bonding while accommodating minor dimensional variations, thereby improving assembly robustness without requiring extremely tight manufacturing tolerances.
2Stability of the object's composition
If coupling structures are plated along metal layers and via holes to provide coupling connection, then connection stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The coupling structure integrates multiple functions into a single plated feature: electrical connection through via holes, mechanical support along metal layers, and alignment reference. This merging provides stable coupling connections while using standard PCB plating processes that are well-established in manufacturing, avoiding the need for specialized high-precision plating techniques.
Solution Approach 2:
Coupling pads and via holes are prepared in advance during PCB fabrication with predetermined positions and dimensions. Alignment marks and fiducial features are pre-formed to guide the coupling process, reducing the precision requirements during final assembly while ensuring stable electrical and mechanical connections.
3Strength
If adhesive material is used to couple PCBs together, then assembly robustness is improved, but alignment precision may be compromised
Solution Approach 1:
The adhesive material acts as a compliant intermediary layer between PCB coupling structures. It provides strong bonding while absorbing minor misalignments through its viscoelastic properties, thereby maintaining assembly robustness without requiring sub-micron alignment precision that would be difficult and costly to achieve.
Solution Approach 2:
The adhesive layer thickness and material properties are carefully controlled to optimize the balance between bonding strength and alignment tolerance. By adjusting these parameters, the system achieves robust assembly with relaxed alignment requirements, as the adhesive can accommodate certain dimensional variations while maintaining strong mechanical and electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high-performance antennas with stable coupling connections, enhancing mass production reliability and reducing misalignment issues, thus improving communication equipment efficiency.
Implementation Method 1
an adhesive material configured to couple the first PCB and the second PCB to each other
Implementation Method 2
a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer
Data Source
AI summary
The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.